Patents by Inventor Rene Hummel

Rene Hummel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230358704
    Abstract: In a method for manufacturing an electrochemical gas sensor for sensing a target gas, a semi-manufactured gas sensor is provided. The semi-manufactured gas sensor comprises a substrate supporting an arrangement comprising a thin film of a thickness s?5 pm arranged between a sensing electrode configured to chemically interact with the target gas and a reference electrode facing the substrate. The thin film is an electronically non-conducting and ionically non-conducting ceramic or glass. The arrangement then is heated to an annealing temperature for irreversibly turning the thin film into an ionic conductor by incorporating mobile ions released from the sensing electrode in response to the heating.
    Type: Application
    Filed: September 17, 2021
    Publication date: November 9, 2023
    Inventors: Frank RÖCK, Marc GUBSER, Nicolas DAIX, Lukas BÜRGI, René HUMMEL
  • Patent number: 10816422
    Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: October 27, 2020
    Assignee: InvenSense, Inc.
    Inventors: Chung-Hsien Lin, Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang, Wang Shen Su, Chia Min Lin
  • Patent number: 10712218
    Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: July 14, 2020
    Assignee: InvenSense, Inc.
    Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Ming Lin
  • Publication number: 20190226932
    Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.
    Type: Application
    Filed: March 29, 2019
    Publication date: July 25, 2019
    Inventors: Johannes SCHUMM, Andreas REINHARD, Thomas KRAEHENBUEHL, Stefan THIELE, Rene HUMMEL, Chung-Hsien LIN, Wang Shen SU, Tsung Lin TANG, Chia Ming LIN
  • Patent number: 10254185
    Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: April 9, 2019
    Assignee: InvenSense, Inc.
    Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
  • Patent number: 10161817
    Abstract: A pressure sensor comprises a first substrate containing a processing circuit integrated thereon and a cap attached to the first substrate. The cap includes a container, a holder, and one or more suspension elements for suspending the container from the holder. The container includes a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. The container is suspended from the holder such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: December 25, 2018
    Assignee: InvenSense, Inc.
    Inventors: Felix Mayer, Marc Von Waldkirch, Johannes Buhler, Rene Hummel, Stephan Braun, Marion Hermersdorf, Chung-Hsien Lin
  • Publication number: 20180202882
    Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.
    Type: Application
    Filed: March 14, 2018
    Publication date: July 19, 2018
    Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
  • Patent number: 9958349
    Abstract: A pressure sensor comprises a deformable membrane deflecting in response to pressure applied, a first stationary electrode, and a second electrode coupled to the deformable membrane, for determining a change in a capacitance between the first and the second electrode in response to the pressure applied. At least one of the first and the second electrode comprises a getter material for collecting gas molecules.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: May 1, 2018
    Assignee: INVENSENSE, INC.
    Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
  • Publication number: 20170167933
    Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
    Type: Application
    Filed: February 24, 2017
    Publication date: June 15, 2017
    Inventors: Chung-Hsien LIN, Rene HUMMEL, Ulrich BARTSCH, Marion HERMERSDORF, Tsung Lin TANG, Wang Shen SU, Chia Min LIN
  • Patent number: 9581512
    Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: February 28, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Chung-Hsien Lin, Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang, Wang Shen Su, Chia Min Lin
  • Publication number: 20160290883
    Abstract: A pressure sensor comprises a deformable membrane deflecting in response to pressure applied, a first stationary electrode, and a second electrode coupled to the deformable membrane, for determining a change in a capacitance between the first and the second electrode in response to the pressure applied. At least one of the first and the second electrode comprises a getter material for collecting gas molecules.
    Type: Application
    Filed: March 30, 2016
    Publication date: October 6, 2016
    Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
  • Patent number: 9224658
    Abstract: A sensing device has a semiconductor substrate with an opening and a membrane spanning the opening. A heater is arranged on the membrane. To reduce the thermal conductivity of the membrane, a recess is etched into the membrane from below.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: December 29, 2015
    Assignee: Sensirion AG
    Inventors: Robert Sunier, Cyrill Kuemin, Rene Hummel
  • Patent number: 9140740
    Abstract: The present sensor chip comprises a substrate. A plurality of electrode elements is arranged at a first level on the substrate with at least one gap between neighboring electrode elements. A metal structure is arranged at a second level on the substrate, wherein the second level is different from the first level. The metal structure at least extends over an area of the second level that is defined by a projection of the at least one gap towards the second level.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: September 22, 2015
    Assignee: Sensirion AG
    Inventors: Rene Hummel, Ralph Steiner-Vanha, Ulrich Bartsch
  • Publication number: 20150122041
    Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
    Type: Application
    Filed: November 6, 2014
    Publication date: May 7, 2015
    Inventors: Chung-Hsien LIN, Rene HUMMEL, Ulrich BARTSCH, Marion HERMERSDORF, Tsung Lin TANG, Wang Shen SU, Chia Min LIN
  • Publication number: 20150122038
    Abstract: A pressure sensor comprises a first substrate containing a processing circuit integrated thereon and a cap attached to the first substrate. The cap includes a container, a holder, and one or more suspension elements for suspending the container from the holder. The container includes a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. The container is suspended from the holder such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit.
    Type: Application
    Filed: October 23, 2014
    Publication date: May 7, 2015
    Inventors: Felix MAYER, Marc VON WALDKIRCH, Johannes BUHLER, Rene HUMMEL, Stephan BRAUN, Marion HERMERSDORF, Chung-Hsien LIN
  • Publication number: 20150122042
    Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
    Type: Application
    Filed: October 23, 2014
    Publication date: May 7, 2015
    Inventors: Chung-Hsien LIN, Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang, Wang Shen Su, Chia Min Lin
  • Patent number: 8815623
    Abstract: A differential pressure sensor comprises a membrane arranged over a cavity on a semiconductor substrate. A lid layer is arranged at the top side of the device and comprises an access opening for providing access to the top side of the membrane. A channel extends laterally from the cavity and intersects with a bore. The bore is formed by laser drilling from the bottom side of the substrate and provides access to the bottom side of the membrane. The bore extends all through the substrate and optionally into the lid layer.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: August 26, 2014
    Assignee: Sensirion AG
    Inventors: Johannes Bühler, Felix Mayer, Matthias Streiff, René Hummel, Robert Sunier
  • Publication number: 20140225202
    Abstract: The invention relates to a chemical sensor (1) comprising a substrate layer (2) having a front surface (2.1) and a back surface (2.2) and a sensing layer (3) arranged on the front surface (2.1) of the substrate layer (2), the sensing layer (3) comprising a sensing element (4) and the substrate layer (2) being provided with a well (5) in the back surface (2.2) to a form a membrane (6) that incorporates the sensing element (4), wherein the substrate layer (2) is provided with contact pads (10) on the back surface (2.2) and with vias (11) extending from the front surface (2.1) to the back surface (2.2) for electrically connecting the sensing element (4) with the contact pads (10), wherein a handling layer (17) is provided on top of the sensing layer (3), the handling layer (17) surrounding the sensing element (4), and wherein the thickness (d1) of the handling layer (17) is larger than the thickness (d2) of the substrate layer (2).
    Type: Application
    Filed: January 22, 2014
    Publication date: August 14, 2014
    Inventors: Felix MAYER, Moritz LECHNER, Cyrill KUEMIN, Rene HUMMEL, Robert SUNIER
  • Publication number: 20140210036
    Abstract: A sensing device has a semiconductor substrate with an opening and a membrane spanning the opening. A heater is arranged on the membrane. To reduce the thermal conductivity of the membrane, a recess is etched into the membrane from below.
    Type: Application
    Filed: January 22, 2014
    Publication date: July 31, 2014
    Inventors: Robert SUNIER, Cyrill KUEMIN, Rene HUMMEL
  • Publication number: 20140159745
    Abstract: The present sensor chip comprises a substrate. A plurality of electrode elements is arranged at a first level on the substrate with at least one gap between neighbouring electrode elements. A metal structure is arranged at a second level on the substrate, wherein the second level is different from the first level. The metal structure at least extends over an area of the second level that is defined by a projection of the at least one gap towards the second level.
    Type: Application
    Filed: December 6, 2013
    Publication date: June 12, 2014
    Inventors: Rene HUMMEL, Ralph STEINER-VANHA, Ulrich BARTSCH