Patents by Inventor Rene J. Sanchez

Rene J. Sanchez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11112521
    Abstract: A capacitive proximity sensor may include a proximity sensing capacitor to provide a voltage output based on a voltage input, the capacitor including a ground plane and an electrode loop capacitively coupled to the ground plane. The proximity sensor may include a processor to detect an object proximity based on a change in the voltage output. This proximity sensor provides automated detection of a person, and thereby reduces the need for a vehicle occupant or child caregiver to activate a sensor by pressing a button. The use of a capacitance-based proximity sensor reduces issues associated with fabric, clothing, or other materials separating the proximity sensor from a person.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: September 7, 2021
    Assignee: Intel Corporation
    Inventors: Marcie M. Miller, Roderick E. Kronschnabel, Matthew J. Schneider, Rene J. Sanchez, Christopher L. Ross, Ryan R. Carnaghi, Keith A. Swesey, Kevin Edwards, Steven W. Whitehorn, Cecilia Yancy, Thomas V. Moss
  • Publication number: 20200142088
    Abstract: A capacitive proximity sensor may include a proximity sensing capacitor to provide a voltage output based on a voltage input, the capacitor including a ground plane and an electrode loop capacitively coupled to the ground plane. The proximity sensor may include a processor to detect an object proximity based on a change in the voltage output. This proximity sensor provides automated detection of a person, and thereby reduces the need for a vehicle occupant or child caregiver to activate a sensor by pressing a button. The use of a capacitance-based proximity sensor reduces issues associated with fabric, clothing, or other materials separating the proximity sensor from a person.
    Type: Application
    Filed: June 18, 2019
    Publication date: May 7, 2020
    Inventors: Marcie M. Miller, Roderick E. Kronschnabel, Matthew J. Schneider, Rene J. Sanchez, Christopher L. Ross, Ryan R. Carnaghi, Keith A. Swesey, Kevin Edwards, Steven W. Whitehorn, Cecilia Yancy, Thomas V. Moss
  • Patent number: 10324213
    Abstract: A capacitive proximity sensor may include a proximity sensing capacitor to provide a voltage output based on a voltage input, the capacitor including a ground plane and an electrode loop capacitively coupled to the ground plane. The proximity sensor may include a processor to detect an object proximity based on a change in the voltage output. This proximity sensor provides automated detection of a person, and thereby reduces the need for a vehicle occupant or child caregiver to activate a sensor by pressing a button. The use of a capacitance-based proximity sensor reduces issues associated with fabric, clothing, or other materials separating the proximity sensor from a person.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: June 18, 2019
    Assignee: Intel Corporation
    Inventors: Marcie M. Miller, Roderick E. Kronschnabel, Matthew J. Schneider, Rene J. Sanchez, Christopher L. Ross, Ryan R. Carnaghi, Keith A. Swesey, Kevin Edwards, Steven W. Whitehorn, Cecilia Yancy, Thomas V. Moss
  • Patent number: 10228418
    Abstract: Embodiments of alignment fixtures for integrated circuit (IC) packages, and related techniques, are disclosed herein. In some embodiments, an alignment fixture for an IC package may include: a first socket having a recess dimensioned to receive a first surface of the IC package and having a first magnet arrangement disposed outside of the recess, wherein the IC package has a second surface opposite to the first surface and has a first electrical contact element on the second surface; and a second socket having a second electrical contact element and having a second magnet arrangement. The first and second electrical contact elements may be aligned when the IC package is disposed in the recess, the IC package is disposed between the first and second sockets, and the first magnet arrangement is in a predetermined equilibrium relation with the second magnet arrangement to mate the first and second sockets.
    Type: Grant
    Filed: April 21, 2014
    Date of Patent: March 12, 2019
    Assignee: INTEL CORPORATION
    Inventors: Sruti Chigullapalli, Rene J. Sanchez, Nader N. Abazarnia, Todd R. Coons, Tuan Hoong Goh
  • Publication number: 20180354443
    Abstract: A system and method for child car seat safety detection and notification are disclosed. A particular embodiment is configured to: provide at least one sensor to measure a condition present in an environment in which a child is restrained in a child car seat in a vehicle; determine, based on sensor data from the sensor, if the condition requires a notification to be sent to a user; generate a notification message including at least a portion of the sensor data and information indicative of a location of the child car seat; send the notification message to a mobile device application; and send the notification message to a vehicle subsystem application.
    Type: Application
    Filed: December 18, 2015
    Publication date: December 13, 2018
    Inventors: Nona Ebrahimi, Joseph M. Romeo, Christopher L. Ross, Rene J. Sanchez, Marcie M. Miller, Jill C. Sciarappo, Amarnath Kona, Shubhada H. Sahasrabudhe, Matthew J. Schneider, Rod E. Kronschnabel, Thomas V. Moss, Steven Whitehorn, Kevin Edwards, Keith A. Swesey, Cecilia Yancy, Camilo F. Gomez
  • Publication number: 20180059279
    Abstract: A capacitive proximity sensor may include a proximity sensing capacitor to provide a voltage output based on a voltage input, the capacitor including a ground plane and an electrode loop capacitively coupled to the ground plane. The proximity sensor may include a processor to detect an object proximity based on a change in the voltage output. This proximity sensor provides automated detection of a person, and thereby reduces the need for a vehicle occupant or child caregiver to activate a sensor by pressing a button. The use of a capacitance-based proximity sensor reduces issues associated with fabric, clothing, or other materials separating the proximity sensor from a person.
    Type: Application
    Filed: December 21, 2016
    Publication date: March 1, 2018
    Inventors: Marcie M. Miller, Roderick E. Kronschnabel, Matthew J. Schneider, Rene J. Sanchez, Christopher L. Ross, Ryan R. Carnaghi, Keith A. Swesey, Kevin Edwards, Steven W. Whitehorn, Cecilia Yancy, Thomas V. Moss
  • Publication number: 20170123001
    Abstract: Embodiments of alignment fixtures for integrated circuit (IC) packages, and related techniques, are disclosed herein. In some embodiments, an alignment fixture for an IC package may include: a first socket having a recess dimensioned to receive a first surface of the IC package and having a first magnet arrangement disposed outside of the recess, wherein the IC package has a second surface opposite to the first surface and has a first electrical contact element on the second surface; and a second socket having a second electrical contact element and having a second magnet arrangement. The first and second electrical contact elements may be aligned when the IC package is disposed in the recess, the IC package is disposed between the first and second sockets, and the first magnet arrangement is in a predetermined equilibrium relation with the second magnet arrangement to mate the first and second sockets.
    Type: Application
    Filed: April 21, 2014
    Publication date: May 4, 2017
    Inventors: Sruti CHIGULLAPALLI, Rene J. SANCHEZ, Nader N. ABAZARNIA, Todd R. COONS, Tuan Hoong GOH
  • Patent number: 9638747
    Abstract: Placing integrated circuit devices using a perturbation is described. In one example, a testing platform has a circuit board. A socket is on the board for receiving and connecting to an integrated circuit package. The socket has an array of pins to engage connection bumps on a surface of the package and a biasing feature to guide the package into alignment with the pins of the socket. A perturbation source induces movement of the package into alignment with the pins of the socket.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: May 2, 2017
    Assignee: Intel Corporation
    Inventors: Paul J. Diglio, Nader N. Abazarnia, Christopher R. Schroeder, Rene J. Sanchez, Morten S. Jensen
  • Publication number: 20150185281
    Abstract: Placing integrated circuit devices using a perturbation is described. In one example, a testing platform has a circuit board. A socket is on the board for receiving and connecting to an integrated circuit package. The socket has an array of pins to engage connection bumps on a surface of the package and a biasing feature to guide the package into alignment with the pins of the socket. A perturbation source induces movement of the package into alignment with the pins of the socket.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 2, 2015
    Inventors: Paul J. Diglio, Nader N. Abazarnia, Christopher R. Schroeder, Rene J. Sanchez, Morten S. Jensen