Abstract: A method of producing a lens with an embedded foil, comprising the steps of positioning a foil (10) on a foil fixation holder, providing adhesive attachment dots (41) on the foil (10) on surface portions (12) opposite to the foil fixation holder, positioning the front mould (30) ensuring the contact of the attachment dots (41) with a surface (31) of the front mould (30), retracting the foil fixation holder and positioning a back mould (120) opposite to the front mould (30).

Abstract: A method of producing a lens with an embedded foil, comprising the steps of positioning a foil (10) on a foil fixation holder, providing adhesive attachment dots (41) on the foil (10) on surface portions (12) opposite to the foil fixation holder, positioning the front mould (30) ensuring the contact of the attachment dots (41) with a surface (31) of the front mould (30), retracting the foil fixation holder and positioning a back mould (120) opposite to the front mould (30).

Abstract: A lens with an embedded foil is produced by positioning a foil on a holder, providing adhesive attachment dots on the foil on surface portions opposite to the holder, positioning a front mould ensuring the contact of the dots with a front mould surface, retracting the holder and positioning a back mould opposite to the front mould. The mould is then connected with a sealing bridge to build an assembly forming a mould cavity with a pouring opening. The edge of the foil is spaced apart from the bridge and the assembly has passages between the dots, the foil, and the front mould surface allowing pouring a monomer into the cavity before curing the monomer, decomposing the assembly and cutting the lens from the polymer block.

Abstract: A lens with an embedded foil is produced by positioning a foil on a holder, providing adhesive attachment dots on the foil on surface portions opposite to the holder, positioning a front mould ensuring the contact of the dots with a front mould surface, retracting the holder and positioning a back mould opposite to the front mould. The mould is then connected with a sealing bridge to build an assembly forming a mould cavity with a pouring opening. The edge of the foil is spaced apart from the bridge and the assembly has passages between the dots, the foil, and the front mould surface allowing pouring a monomer into the cavity before curing the monomer, decomposing the assembly and cutting the lens from the polymer block.

Abstract: A method for producing and coating a lens includes: applying a curable paste along the edge of a first molding shell and along the edge of the second molding shell, connecting the two molding shells by means of a sealing element to form a unit, casting a monomer into the unit, curing the monomer and the paste so that the lens is formed, detaching the sealing element from the unit, separating the lens from the two molding shells, placing the lens in a vacuum chamber of a vacuum-coating installation, and coating an optical surface of the lens, wherein no washing process is carried out between the step of separating the lens from the two molding shells and the step of placing the lens in the vacuum chamber.

Abstract: A method for producing and coating a lens comprises: applying a curable paste along the edge of a first moulding shell and along the edge of the second moulding shell, connecting the two moulding shells by means of a sealing element to form a unit, casting a monomer into the unit, curing the monomer and the paste so that the lens is formed, detaching the sealing element from the unit, separating the lens from the two moulding shells, placing the lens in a vacuum chamber of a vacuum-coating installation, and coating an optical surface of the lens, wherein no washing process is carried out between the step of separating the lens from the two moulding shells and the step of placing the lens (8) in the vacuum chamber.

Abstract: A foil perforation needle for perforating a foil and detaching a die from the foil has a shaft, which passes at one end into a blade having a cutting edge. The cutting edge minimizes the strain per unit area occurring upon impact on the foil and, after the perforation of the foil, upon impact on the die.

Abstract: A pick-up tool for gripping a die comprises a sleeve and a gripping member. The sleeve has a longitudinal bore extending in the longitudinal direction in which the gripping member is inserted. The gripping member is held in the sleeve displaceably in the longitudinal direction. A portion of the gripping member protrudes from the sleeve. The gripping member assumes a predetermined position relative to the sleeve at the absence of any external action of force on the portion of the gripping member protruding from the sleeve, in which the portion of the gripping member protruding from the sleeve is held in a play-free manner radially to the longitudinal direction. In the case of action of force in the longitudinal direction on the portion of the gripping member protruding from the sleeve, the gripping member can be inserted further into the sleeve and is then radially movably held in the longitudinal bore of the sleeve. The mass of the gripping member is not more than 1 gram.

Abstract: The mounting of semiconductor chips onto a flexible substrate takes place in three steps: Firstly, at a dispensing station, adhesive is applied to predetermined substrate sites on the substrate. Then, at a bonding station, semiconductor chips are placed onto the substrate sites. Finally, curing of the adhesive takes place. In accordance with the invention, the substrate is fixed onto a level support surface by means of vacuum during the hardening of the adhesive.

Abstract: A pick-up tool for the mounting of semiconductor chips onto a substrate has a suction device which consists of a plate made out of a dimensionally stable material one surface of which has structures made of hardened adhesive. The material for the plate is, for example, aluminum, a carbon fiber composite material or a dimensionally stable plastic. A suitable material for the structure is, for example, an adhesive which has Teflon® as the filing material.

Abstract: A pick-up tool for the mounting of semiconductor chips onto a substrate has a suction device which consists of a plate made out of a dimensionally stable material one surface of which has structures made of hardened adhesive. The material for the plate is, for example, aluminum, a carbon fiber composite material or a dimensionally stable plastic. A suitable material for the structure is, for example, an adhesive which has Teflon® as the filing material.

Abstract: The mounting of semiconductor chips onto a flexible substrate takes place in three steps: Firstly, at a dispensing station, adhesive is applied to predetermined substrate sites on the substrate. Then, at a bonding station, semiconductor chips are placed onto the substrate sites. Finally, curing of the adhesive takes place. In accordance with the invention, the substrate is fixed onto a level support surface by means of vacuum during the hardening of the adhesive.