Patents by Inventor Rene Lamothe

Rene Lamothe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Closed loop cooling system for a junction box in a vehicle, and related components, systems, and methods
    Patent number: 11026352
    Abstract: A closed loop cooling system for a junction box in a vehicle includes a junction box housing and a storage compartment for a vehicle. A cool air duct interior volume of a cool air duct and a warm air duct interior volume of a warm air duct are each in fluidic communication with a housing interior volume of the junction box housing and a compartment interior volume of the storage compartment to form a closed loop cooling system. The cool air duct interior volume is sized to convey cool air from a cool air outlet of the storage compartment to a cool air inlet of the junction box housing, and the warm air duct interior volume is sized to convey warm air, which is warmer than the cool air, from a warm air outlet of the junction box housing to a warm air inlet of the storage compartment.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: June 1, 2021
    Assignee: VOLVO TRUCK CORPORATION
    Inventors: François Matte, Pascal Duguay, René Lamothe
  • CLOSED LOOP COOLING SYSTEM FOR A JUNCTION BOX IN A VEHICLE, AND RELATED COMPONENTS, SYSTEMS, AND METHODS
    Publication number: 20190230824
    Abstract: A closed loop cooling system for a junction box in a vehicle includes a junction box housing and a storage compartment for a vehicle. A cool air duct interior volume of a cool air duct and a warm air duct interior volume of a warm air duct are each in fluidic communication with a housing interior volume of the junction box housing and a compartment interior volume of the storage compartment to form a closed loop cooling system. The cool air duct interior volume is sized to convey cool air from a cool air outlet of the storage compartment to a cool air inlet of the junction box housing, and the warm air duct interior volume is sized to convey warm air, which is warmer than the cool air, from a warm air outlet of the junction box housing to a warm air inlet of the storage compartment.
    Type: Application
    Filed: June 27, 2016
    Publication date: July 25, 2019
    Applicant: VOLVO GROUP CANADA INC.
    Inventors: François Matte, Pascal Duguay, René Lamothe
  • SEMICONDUCTOR WAFER FRONT SIDE PROTECTION
    Publication number: 20080064185
    Abstract: There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.
    Type: Application
    Filed: October 29, 2007
    Publication date: March 13, 2008
    Applicant: International Business Machines Corporation
    Inventors: Allan Abrams, Donald Brouillette, Joseph Danaher, Timothy Krywanczyk, Rene Lamothe, Ivan Stone, Matthew Whalen
  • Semiconductor wafer front side protection
    Patent number: 7288465
    Abstract: There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.
    Type: Grant
    Filed: April 28, 2005
    Date of Patent: October 30, 2007
    Assignee: International Business Machines Corpoartion
    Inventors: Allan D. Abrams, Donald W. Brouillette, Joseph D. Danaher, Timothy C. Krywanczyk, Rene A. Lamothe, Ivan J. Stone, Matthew R. Whalen
  • Semiconductor wafer front side protection
    Patent number: 7001827
    Abstract: There is provided a method for making a wafer including the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.
    Type: Grant
    Filed: April 15, 2003
    Date of Patent: February 21, 2006
    Assignee: International Business Machines Corporation
    Inventors: Allan D. Abrams, Donald W. Brouillette, Joseph D. Danaher, Timothy C. Krywanczyk, Rene A. Lamothe, Ivan J. Stone, Matthew R. Whalen
  • Semiconductor wafer front side protection
    Publication number: 20050202678
    Abstract: There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.
    Type: Application
    Filed: April 28, 2005
    Publication date: September 15, 2005
    Applicant: International Business Machines Corporation
    Inventors: Allan Abrams, Donald Brouillette, Joseph Danaher, Timothy Krywanczyk, Rene Lamothe, Ivan Stone, Matthew Whalen
  • Semiconductor wafer front side protection
    Publication number: 20040209444
    Abstract: There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.
    Type: Application
    Filed: April 15, 2003
    Publication date: October 21, 2004
    Applicant: International Business Machines Corporation
    Inventors: Allan D. Abrams, Donald W. Brouillette, Joseph D. Danaher, Timothy C. Krywanczyk, Rene A. Lamothe, Ivan J. Stone, Matthew R. Whalen