Patents by Inventor Rene Lanners

Rene Lanners has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite copper foil and manufacturing method thereof
    Patent number: 7153590
    Abstract: A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer (14) is on the electrolyte side of said carrier foil (12). A thin functional foil (16) formed by deposition of copper has a front side in contact with the release layer (14) and an opposite back side. The electrolyte side of the carrier foil (12) has a surface roughness Rz less than or equal to 3.5 ?m. There is also presented a method for manufacturing such a composite copper foil.
    Type: Grant
    Filed: January 18, 2001
    Date of Patent: December 26, 2006
    Assignee: Circuit Foil Luxembourg Trading S.a.R.L.
    Inventors: Raymond Gales, René Lanners, Michel Streel, Akitoshi Suzuki
  • Composite foil and its manufacturing process
    Patent number: 7049007
    Abstract: A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group including zinc, molybdenum, antimony and tungsten, and an electrodeposited, ultra-thin metal foil on the second metallic layer.
    Type: Grant
    Filed: July 10, 2002
    Date of Patent: May 23, 2006
    Assignee: Circuit Foil Luxembourg Sarl
    Inventors: Raymond Gales, Michel Streel, Rene Lanners
  • Composite foil and its manufacturing process
    Publication number: 20040209106
    Abstract: A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group including zinc, molybdenum, antimony and tungsten, and an electrodeposited, ultra-thin metal foil on the second metallic layer.
    Type: Application
    Filed: January 16, 2004
    Publication date: October 21, 2004
    Inventors: Raymond Gales, Michel Streel, Rene Lanners
  • Composite copper foil and manufacturing method thereof
    Publication number: 20030012975
    Abstract: A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer (14) is on the electrolyte side of said carrier foil (12). A thin functional foil (16) formed by deposition of copper has a front side in contact with the release layer (14) and an opposite back side. The electrolyte side of the carrier foil (12) has a surface roughness Rz less than or equal to 3.5 &mgr;m. There is also presented a method for manufacturing such a composite copper foil.
    Type: Application
    Filed: August 19, 2002
    Publication date: January 16, 2003
    Inventors: Raymond Gales, Rene ` Lanners, Michel Streel, Akitoshi Suzuki