Abstract: A device for holding disk-shaped objects, particularly semiconductor wafers, having at least three contact elements for depositing and/or fixing the disk-shaped object at its outer edge area. The contact elements are designed such that they have an incline facing the object and a supporting surface.

Abstract: A system for inspecting a disc-shaped substrate 5 is disclosed. The system 100 is surrounded by a housing. A table 2 that is movable in at least an X-direction and a Y-direction and is borne by a mounting plate 22 is provided within the housing 50. The mounting plate 22 is vibration isolated in comparison to the housing 50. Equally, an exhaust unit 40 is provided beneath the mounting plate 22 and arranged at a distance from it. The exhaust unit 40 possesses an opening 36 for air entry. The opening 36 for air entry is provided in the exhaust unit between an end of the mounting plate 22 and a wall of the housing 50.

Abstract: An apparatus for holding disk-like objects, in particular semiconductor wafers (12), with at least three contacting elements (18) for supporting and/or fixing the disk-like object at its outer edge region (22). It is provided that at least one of the contacting elements (18) is moveable.

Abstract: A method of determining geometric parameters of a wafer (16) is disclosed. For this purpose, the wafer (16) is inserted in a wafer holder (30). The wafer holder (30) is equipped with at least three mechanical contacting elements (22). The wafer is in mechanical contact with the contacting elements (22). The contacting elements (22) are distributed on the wafer holder (30) in such a way that they define a geometric figure which is configured such that the center point (40) of the wafer (16) comes to lie within the geometric figure. The position of each contacting element (22) is determined. Each desired geometric parameter of the wafer (16) is then calculated from the position of the contacting elements (22).

Abstract: A system for the detection of macrodefects is disclosed, the system being surrounded by a housing (50) and being subdivided into a first segment (6), a second segment (8), and a third segment (10). Provided in the second segment (8) is a stage (2), displaceable in the X direction and Y direction, on which a wafer (25) is placed. Located in the first segment (6) is an aspiration device (36) that directs aspirated air via an air guide (37) into the second segment (8), the air guide (37) encompassing several air-directing panels (38) so that an air flow (60) is guided in parallel fashion over the wafer (25).

Abstract: An apparatus for handling disk-like objects is disclosed, wherein the apparatus consists of at least one load port, one transfer unit, and one system unit. Between the transfer unit and the system unit an internal separating wall is formed. Further, an external separating wall is provided, which is constructed in such a way that it positions the transfer unit in a first partial room and the system unit in a second partial room.

Abstract: A method for determining the lateral offset of an XYZ stage includes, by shifting the XYZ stage in the Z direction, acquiring a series of images. In the last image acquired in the series of individual images, a feature of interest is searched for and is positioned at the center of the microscope's image field. Proceeding from the reference image, the lateral offset in the X direction and Y direction is then ascertained for each further image.

Abstract: An apparatus for inspecting the front side and the back side 2, 3 of a disc-shaped object 4 is disclosed. A detection unit 5 has a first detector element 6 facing the front side 2 and a second detector element 7 facing the back side of the disc-shaped object 4. Furthermore, a means 8 is provided for generating a relative movement between the detection unit 5 and the disc-shaped object 4 so that an image is made of the front side and the back side 2, 3 of the disc-shaped object 4.

Abstract: A system for the detection of macrodefects is disclosed, the system being surrounded by a housing (50) and being subdivided into a first segment (6), a second segment (8), and a third segment (10). Provided in the second segment (8) is a stage (2), displaceable in the X direction and Y direction, on which a wafer (25) is placed. Located in the first segment (6) is an aspiration device (36) that directs aspirated air via an air guide (37) into the second segment (8), the air guide (37) encompassing several air-directing panels (38) so that an air flow (60) is guided in parallel fashion over the wafer (25).