Abstract: The invention relates to a process for manufacturing a power circuit board in which, on the one hand, a printed circuit board including an insulating substrate and a conductive track on one of the sides of the substrate, and on the other hand, a bus bar element, are provided. The bus bar element is welded to the conductive track using a laser. In order to make it possible to produce the weld by laser welding, even with a relatively thick bus bar, the welding is carried out in a zone that is thinner relative to the maximum thickness of the bus bar. Thus, a printed circuit board is obtained with a bus bar having a thick zone for conducting high currents and a thinner zone in order to allow the bus bar to be welded to the conductive track by laser welding.

Abstract: The invention relates to a process for manufacturing a power circuit board in which, on the one hand, a printed circuit board including an insulating substrate and a conductive track on one of the sides of the substrate, and on the other hand, a bus bar element, are provided. The bus bar element is welded to the conductive track using a laser. In order to make it possible to produce the weld by laser welding, even with a relatively thick bus bar, the welding is carried out in a zone that is thinner relative to the maximum thickness of the bus bar. Thus, a printed circuit board is obtained with a bus bar having a thick zone for conducting high currents and a thinner zone in order to allow the bus bar to be welded to the conductive track by laser welding.