Patents by Inventor Rene Theodora Hubertus Rongen

Rene Theodora Hubertus Rongen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9941222
    Abstract: Disclosed is an integrated circuit comprising a substrate carrying a plurality of circuit elements; a metallization stack interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion; a passivation stack covering the metallization stack; and a sensor including a sensing material on the passivation stack, said sensor being coupled to the first metal portion by a via extending through the passivation stack. A method of manufacturing such an IC is also disclosed.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: April 10, 2018
    Assignee: ams International AG
    Inventors: Roel Daamen, Robertus Adrianus Maria Wolters, Rene Theodora Hubertus Rongen, Youri Victorovitch Ponomarev
  • Publication number: 20160197047
    Abstract: Disclosed is an integrated circuit comprising a substrate carrying a plurality of circuit elements; a metallization stack interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion; a passivation stack covering the metallization stack; and a sensor including a sensing material on the passivation stack, said sensor being coupled to the first metal portion by a via extending through the passivation stack. A method of manufacturing such an IC is also disclosed.
    Type: Application
    Filed: March 14, 2016
    Publication date: July 7, 2016
    Inventors: Roel DAAMEN, Robertus Adrianus Maria WOLTERS, Rene Theodora Hubertus RONGEN, Youri Victorovitch PONOMAREV
  • Patent number: 9284187
    Abstract: Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20); a passivation stack (24, 26, 28) covering the metallization stack; and a sensor including a sensing material (40) on the passivation stack, said sensor being coupled to the first metal portion by a via (34) extending through the passivation stack. A method of manufacturing such an IC is also disclosed.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: March 15, 2016
    Assignee: ams International AG
    Inventors: Roel Daamen, Robertus Adrianus Maria Wolters, Rene Theodora Hubertus Rongen, Youri Victorovitch Ponomarev
  • Publication number: 20120211845
    Abstract: Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20); a passivation stack (24, 26, 28) covering the metallization stack; and a sensor including a sensing material (40) on the passivation stack, said sensor being coupled to the first metal portion by a via (34) extending through the passivation stack. A method of manufacturing such an IC is also disclosed.
    Type: Application
    Filed: February 16, 2012
    Publication date: August 23, 2012
    Applicant: NXP B.V.
    Inventors: Roel Daamen, Robertus Adrianus Maria Wolters, Rene Theodora Hubertus Rongen, Youri Victorovitch Ponomarev