Abstract: A lithography system and a lithography method is provided for increasing reliability and efficiency of immersion lithography. By varying a scan speed between a wafer and an optical component depending on at least one process parameter during exposure of the wafer, loosening of a fluid meniscus during the relative movement of the optical component and the wafer is avoided.

Abstract: Fluorine-passivated reticles for use in lithography and methods for fabricating and using such reticles are provided. According to one embodiment, a method for performing photolithography comprises placing a fluorine-passivated reticle between an illumination source and a target semiconductor wafer and causing electromagnetic radiation to pass from the illumination source through the fluorine-passivated reticle to the target semiconductor wafer. In another embodiment, a fluorine-passivated reticle comprises a substrate and a patterned fluorine-passivated absorber material layer overlying the substrate. According to another embodiment, a method for fabricating a reticle for use in photolithography comprises providing a substrate and forming a fluorine-passivated absorber material layer overlying the substrate.

Abstract: A lithography system and a lithography method is provided for increasing reliability and efficiency of immersion lithography. By varying a scan speed between a wafer and an optical component depending on at least one process parameter during exposure of the wafer, loosening of a fluid meniscus during the relative movement of the optical component and the wafer is avoided.

Abstract: The present invention provides a method of forming coatings of at least two different coating molecules on at least two electrodes, the method comprising: (a) providing an array of at least two individually-addressable electrodes, (b) allowing a layer of a masking molecule to adsorb onto all electrodes, (c) inducing electrochemical desorption of the masking molecule from at least one but not all electrodes to expose a first set of exposed electrodes, (d) allowing a first coating molecule to adsorb onto the first set of exposed electrodes, (e) exposing all electrodes to a masking molecule to allow adsorption of the masking molecule onto all electrodes, (f) inducing electrochemical desorption of masking molecule from a second set of electrodes to expose a second set of exposed electrodes, (g) allowing a second coating molecule to adsorb onto the second set of exposed electrodes.