Patents by Inventor Renee J. Behlman

Renee J. Behlman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Gaspath component including minicore plenums
    Patent number: 10808571
    Abstract: A turbine engine component includes a wall extending from a leading edge to a trailing edge. The wall includes a hot side facing a gaspath when the gaspath component is in an installed state, and a cold side opposite the hot side. At least one minicore cooling circuit is disposed between the hot side and the cold side within the wall. At least one cooling fluid inlet connects the minicore cooling circuit to a coolant source. At least one film cooling hole connects the minicore cooling circuit to the hot side surface. The minicore cooling circuit includes an edge plenum having a thickness normal to the hot side surface that is larger than a thickness of the majority of the minicore cooling circuit normal to the hot side surface. The edge plenum is a portion of the at least one minicore cooling circuit most proximate to one of the leading edge and the trailing edge.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: October 20, 2020
    Assignee: Raytheon Technologies Corporation
    Inventors: Tracy A. Propheter-Hinckley, Matthew A. Devore, Renee J. Behlman
  • GASPATH COMPONENT INCLUDING MINICORE PLENUMS
    Publication number: 20180371941
    Abstract: A turbine engine component includes a wall extending from a leading edge to a trailing edge. The wall includes a hot side facing a gaspath when the gaspath component is in an installed state, and a cold side opposite the hot side. At least one minicore cooling circuit is disposed between the hot side and the cold side within the wall. At least one cooling fluid inlet connects the minicore cooling circuit to a coolant source. At least one film cooling hole connects the minicore cooling circuit to the hot side surface. The minicore cooling circuit includes an edge plenum having a thickness normal to the hot side surface that is larger than a thickness of the majority of the minicore cooling circuit normal to the hot side surface. The edge plenum is a portion of the at least one minicore cooling circuit most proximate to one of the leading edge and the trailing edge.
    Type: Application
    Filed: June 22, 2017
    Publication date: December 27, 2018
    Inventors: Tracy A. Propheter-Hinckley, Matthew A. Devore, Renee J. Behlman