Patents by Inventor Renee L. Weisman
Renee L. Weisman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8910853Abstract: In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.Type: GrantFiled: July 1, 2013Date of Patent: December 16, 2014Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu, Eric D. Perfecto, Srinivasa S.N. Reddy, Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof, Julien Sylvestre, Renee L. Weisman
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Publication number: 20130284495Abstract: In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.Type: ApplicationFiled: July 1, 2013Publication date: October 31, 2013Inventors: Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu, Eric D. Perfecto, Srinivasa S.N. Reddy, Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof, Julien Sylvestre, Renee L. Weisman
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Patent number: 8493746Abstract: In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.Type: GrantFiled: February 12, 2010Date of Patent: July 23, 2013Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu, Eric D. Perfecto, Srinivasa S. N. Reddy, Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof, Julien Sylvestre, Renee L. Weisman
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Patent number: 8197612Abstract: Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided.Type: GrantFiled: April 29, 2008Date of Patent: June 12, 2012Assignee: International Business Machines CorporationInventors: James A Busby, Minhua Lu, Valerie A Oberson, Eric D Perfecto, Kamalesh K Srivastava, Brian R Sundlof, Julien Sylvestre, Renee L Weisman
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Patent number: 8156990Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.Type: GrantFiled: April 18, 2008Date of Patent: April 17, 2012Assignee: International Business Machines CorporationInventors: Jay A. Bunt, Donald W. Diangelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr., Lisa A. Hamilton, Thomas A. Kline, Mark J. LaPlante, Hsichang Liu, Sebastian Loscerbo, Govindarajan Natarajan, Olga A. Otieno, Renee L. Weisman
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Patent number: 7947143Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.Type: GrantFiled: April 18, 2008Date of Patent: May 24, 2011Assignee: International Business Machines CorporationInventors: Jay A. Bunt, Donald W. Diangelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr., Lisa A. Hamilton, Thomas A. Kline, Mark J. LaPlante, Hsichang Liu, Sebastian Loscerbo, Govindarajan Natarajan, Olga A. Otieno, Renee L. Weisman
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Patent number: 7836935Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.Type: GrantFiled: April 18, 2008Date of Patent: November 23, 2010Assignee: International Business Machines CorporationInventors: Jay A. Bunt, Donald W. Diangelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr., Lisa A. Hamilton, Thomas A. Kline, Mark J. LaPlante, Hsichang Liu, Sebastian Loscerbo, Govindarajan Natarajan, Olga A. Otieno, Renee L. Weisman
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Publication number: 20100200271Abstract: In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.Type: ApplicationFiled: February 12, 2010Publication date: August 12, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu, Eric D. Perfecto, Srinivasa S.N. Reddy, Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof, Julien Sylvestre, Renee L. Weisman
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Publication number: 20090266447Abstract: Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided.Type: ApplicationFiled: April 29, 2008Publication date: October 29, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: JAMES A. BUSBY, MINHUA LU, VALERIE A. OBERSON, ERIC D. PERFECTO, KAMALESH K. SRIVASTAVA, BRIAN R. SUNDLOF, JULIEN SYLVESTRE, RENEE L. WEISMAN
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Publication number: 20080190565Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.Type: ApplicationFiled: April 18, 2008Publication date: August 14, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jay A. Bunt, Donald W. Diangelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Lisa A. Hamilton, Thomas A. Kline, Mark J. LaPlante, Hsichang Liu, Sebastian Loscerbo, Govindarajan Natarajan, Olga A. Otieno, Renee L. Weisman
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Publication number: 20080190566Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.Type: ApplicationFiled: April 18, 2008Publication date: August 14, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jay A. Bunt, Donald W. Diangelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Lisa A. Hamilton, Thomas A. Kline, Mark J. LaPlante, Hsichang Liu, Sebastian Loscerbo, Govindarajan Natarajan, Olga A. Otieno, Renee L. Weisman
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Publication number: 20080190545Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.Type: ApplicationFiled: April 18, 2008Publication date: August 14, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jay A. Bunt, Donald W. Diangelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Lisa A. Hamilton, Thomas A. Kline, Mark J. LaPlante, Hsichang Liu, Sebastian Loscerbo, Govindarajan Natarajan, Olga A. Otieno, Renee L. Weisman
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Patent number: 7258537Abstract: An apparatus for flattening sintered ceramic electronic packaging substrates having opposing faces with undesired camber interleaves the substrates with spacers. At least one heating zone includes a heat transfer medium movable toward and away from the stack of interleaved ceramic substrates and spacers to apply a desired rate of heat by direct contact with or close proximity to sides of the stack. A plunger applies pressure to the stack in a direction normal to the faces of the substrates. At least one cooling zone includes a heat transfer medium movable toward and away from the stack to remove heat introduced in the heating zone by direct contact with or close proximity to sides of the stack. A reducing gas supply is operatively connected to the at least one heating zone and at least one cooling zone to supply gas to maintain a controlled reducing atmosphere within the apparatus.Type: GrantFiled: September 16, 2004Date of Patent: August 21, 2007Assignee: International Business Machines CorporationInventors: Raschid J Bezama, Renee L Weisman
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Patent number: 6900073Abstract: An apparatus for flattening sintered ceramic electronic packaging substrates having opposing faces with undesired camber interleaves the substrates with spacers. At least one heating zone includes a heat transfer medium movable toward and away from the stack of interleaved ceramic substrates and spacers to apply a desired rate of heat by direct contact with or close proximity to sides of the stack. A plunger applies pressure to the stack in a direction normal to the faces of the substrates. At least one cooling zone includes a heat transfer medium movable toward and away from the stack to remove heat introduced in the heating zone by direct contact with or close proximity to sides of the stack. A reducing gas supply is operatively connected to the at least one heating zone and at least one cooling zone to supply gas to maintain a controlled reducing atmosphere within the apparatus.Type: GrantFiled: April 8, 2003Date of Patent: May 31, 2005Assignee: International Business Machines CorporationInventors: Raschid J. Bezama, Renee L. Weisman
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Publication number: 20040203184Abstract: An apparatus for flattening sintered ceramic electronic packaging substrates having opposing faces with undesired camber interleaves the substrates with spacers. At least one heating zone includes a heat transfer medium movable toward and away from the stack of interleaved ceramic substrates and spacers to apply a desired rate of heat by direct contact with or close proximity to sides of the stack. A plunger applies pressure to the stack in a direction normal to the faces of the substrates. At least one cooling zone includes a heat transfer medium movable toward and away from the stack to remove heat introduced in the heating zone by direct contact with or close proximity to sides of the stack. A reducing gas supply is operatively connected to the at least one heating zone and at least one cooling zone to supply gas to maintain a controlled reducing atmosphere within the apparatus.Type: ApplicationFiled: April 8, 2003Publication date: October 14, 2004Applicant: International Business Machines CorporationInventors: Raschid J. Bezama, Renee L. Weisman
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Patent number: 6740959Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.Type: GrantFiled: August 1, 2001Date of Patent: May 25, 2004Assignee: International Business Machines CorporationInventors: David James Alcoe, Jeffrey Thomas Coffin, Michael Anthony Gaynes, Harvey Charles Hamel, Mario J. Interrante, Brenda Lee Peterson, Megan J. Shannon, William Edward Sablinski, Christopher Todd Spring, Randall Joseph Stutzman, Renee L. Weisman, Jeffrey Allen Zitz
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Patent number: 6562169Abstract: A method of processing greensheets, wherein the following steps are performed: a) providing a greensheet having a width, length, thickness, a first side and a second side; b) bonding to the first side of the greensheet at least one strip, wherein the strip lies in a first plane; c) bonding to the second side of the green sheet at least one strip, wherein the strip lies in a second plane; d) processing the greensheet; and e) removing the strips from the processed greensheet.Type: GrantFiled: January 17, 2001Date of Patent: May 13, 2003Assignee: International Business Machines CorporationInventors: Govindarajan Natarajan, Raschid J. Bezama, Jon A. Casey, Amy C. Flack, Robert W. Pasco, Arnold W. Terpening, Renee L. Weisman
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Publication number: 20030025180Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.Type: ApplicationFiled: August 1, 2001Publication date: February 6, 2003Applicant: International Business Machines CorporationInventors: David James Alcoe, Jeffrey Thomas Coffin, Michael Anthony Gaynes, Harvey Charles Hamel, Mario J. Interrante, Brenda Lee Peterson, Megan J. Shannon, William Edward Sablinski, Christopher Todd Spring, Randall Joseph Stutzman, Renee L. Weisman, Jeffrey Allen Zitz
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Publication number: 20020092600Abstract: A method of processing greensheets, wherein the following steps are performed:Type: ApplicationFiled: January 17, 2001Publication date: July 18, 2002Applicant: International Business Machines CorporationInventors: Govindarajan Natarajan, Raschid J. Bezama, Jon A. Casey, Amy C. Flack, Robert W. Pasco, Arnold W. Terpening, Renee L. Weisman
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Patent number: 6238741Abstract: A process of forming a multi-layer feature on a ceramic or organic article in which first and second layers of paste are sequentially screened through a screening mask wherein the screening mask has not been moved between screening steps. A structure produced by this process is also disclosed.Type: GrantFiled: December 7, 1998Date of Patent: May 29, 2001Assignee: International Business Machines CorporationInventors: James M. Blazick, Michael E. Cropp, James N. Humenik, Gerald H. Leino, Jawahar P. Nayak, Frank V. Ranalli, Deborah A. Sylvester, John A. Trumpetto, James C. Utter, Rao V. Vallabhaneni, Renee L. Weisman