Patents by Inventor Renee Wu

Renee Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Formable interface and shielding structures
    Patent number: 11125513
    Abstract: A formable structure comprises a first material having a first level of viscosity and a second material having a second level of viscosity, wherein the second material is formed to hold at least a portion of the first material in a particular position or a particular shape. The first material can be configured to function as a thermal interface between two or more hardware components. The second material can be configured to have a higher viscosity than the first material. In one illustrative example, the second material can include a light-activated resin that is configured to harden when exposed to one or more treatments. By the use of the first material and second material, the techniques disclosed herein are adaptable to gaps having a wide range of sizes, which is difficult to do with traditional thermal interface materials. The second material can also function as an EMI shield.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: September 21, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Renee Wu, Michael Nikkhoo
  • FORMABLE INTERFACE AND SHIELDING STRUCTURES
    Publication number: 20190049197
    Abstract: A formable structure comprises a first material having a first level of viscosity and a second material having a second level of viscosity, wherein the second material is formed to hold at least a portion of the first material in a particular position or a particular shape. The first material can be configured to function as a thermal interface between two or more hardware components. The second material can be configured to have a higher viscosity than the first material. In one illustrative example, the second material can include a light-activated resin that is configured to harden when exposed to one or more treatments. By the use of the first material and second material, the techniques disclosed herein are adaptable to gaps having a wide range of sizes, which is difficult to do with traditional thermal interface materials. The second material can also function as an EMI shield.
    Type: Application
    Filed: October 15, 2018
    Publication date: February 14, 2019
    Inventors: Renee WU, Michael NIKKHOO
  • FORMABLE INTERFACE AND SHIELDING STRUCTURES
    Publication number: 20170176116
    Abstract: A formable structure comprises a first material having a first level of viscosity and a second material having a second level of viscosity, wherein the second material is formed to hold at least a portion of the first material in a particular position or a particular shape. The first material can be configured to function as a thermal interface between two or more hardware components. The second material can be configured to have a higher viscosity than the first material. In one illustrative example, the second material can include a light-activated resin that is configured to harden when exposed to one or more treatments. By the use of the first material and second material, the techniques disclosed herein are adaptable to gaps having a wide range of sizes, which is difficult to do with traditional thermal interface materials. The second material can also function as an EMI shield.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 22, 2017
    Inventors: Renee Wu, Michael Nikkhoo