Patents by Inventor Renfel He

Renfel He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Underfill composition and packaging process using the same
    Patent number: 9688892
    Abstract: The present invention provides a one part liquid underfill composition comprising an epoxy resin, a latent epoxy curing agent, a photocurable resin or monomer, a photoinitiator, an optional filler, and an optional thermal initiator. Also provided is a packaging process using the underfill composition.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: June 27, 2017
    Assignees: Henkel AG & Co. KGaA, Henkel IP & Holding GmbH
    Inventors: Xiaolong Hu, Derek Wyatt, Jiong England, Paul J. Gleeson, Renfel He
  • UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME
    Publication number: 20150322309
    Abstract: The present invention provides a one part liquid underfill composition comprising an epoxy resin, a latent epoxy curing agent, a photocurable resin or monomer, a photoinitiator, an optional filler, and an optional thermal initiator. Also provided is a packaging process using the underfill composition.
    Type: Application
    Filed: July 21, 2015
    Publication date: November 12, 2015
    Inventors: Xiaolong Hu, Derek Wyatt, Jiong England, Paul J. Gleeson, Renfel He