Patents by Inventor Renhu LI

Renhu LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230292493
    Abstract: The present disclosure provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a substrate and a word line (WL) structure, wherein the substrate includes trenches arranged in parallel intervals; the WL structure is located in the trenches, and includes a dielectric layer and a conductive layer; the dielectric layer covers a bottom surface and a sidewall of the conductive layer; the conductive layer includes a first conductive layer and a second conductive layer; and a first component is doped in the second conductive layer.
    Type: Application
    Filed: June 8, 2022
    Publication date: September 14, 2023
    Inventors: Renhu LI, Ming-Hung HSIEH, Yong LU, Zhicheng SHI