Patents by Inventor Renjie Sui

Renjie Sui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11632059
    Abstract: The present disclosure relates to a submodule topology circuit for a modular multilevel converter and a method for controlling same. The submodule topology comprises an inlet port and an outlet port, at least two half-bridge submodules, a plurality of first switching devices, a plurality of thyristors and a plurality of diodes, wherein the at least two half-bridges are connected in series and are provided between the inlet port and the outlet port, and each of the half-bridge submodules is provided with an input port, a first output port and a second output port.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: April 18, 2023
    Assignees: Yangzhou Power Supply Branch of State Grid Jiangsu Electric Power Co., Ltd., SOUTHEAST UNIVERSITY, State Grid Jiangsu Electric Power Co., Ltd., State Grid Corporation of China
    Inventors: Zhong Liu, Yang Xu, Xin Zhan, Wu Chen, Peipei Li, Dajun Ma, Renjie Sui, Yu Chen
  • Publication number: 20230112838
    Abstract: The present disclosure relates to a submodule topology circuit for a modular multilevel converter and a method for controlling same. The submodule topology comprises an inlet port and an outlet port, at least two half-bridge submodules, a plurality of first switching devices, a plurality of thyristors and a plurality of diodes, wherein the at least two half-bridges are connected in series and are provided between the inlet port and the outlet port, and each of the half-bridge submodules is provided with an input port, a first output port and a second output port.
    Type: Application
    Filed: November 4, 2019
    Publication date: April 13, 2023
    Inventors: Zhong Liu, Yang Xu, Xin Zhan, Wu Chen, Peipei Li, Dajun Ma, Renjie Sui, Yu Chen