Patents by Inventor Renlan SHI

Renlan SHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11649355
    Abstract: A resin composition comprises, based on 100% by weight of the resin composition: 45-70 wt % of a main resin, 20-45 wt % of a chopped glass fiber, 1-3 wt % of a toughening resin, 0.2-0.5 wt % of an unmodified glycidyl methacrylate, and 0-10 wt % of an auxiliaries. The main resin is selected from at least one of PBT resin and PPS resin. The chopped glass fiber has a dielectric constant of 4.0 to 4.4 at 1 MHz.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: May 16, 2023
    Assignee: BYD COMPANY LIMITED
    Inventors: Qing Gong, Wei Zhou, Xiong Zhang, Yue Yu, Renlan Shi
  • Publication number: 20200224030
    Abstract: The present invention discloses a low-dielectric resin composition, a low-dielectric resin/metal composite material and a preparation method thereof, and an electronic device. The resin composition comprises, based on 100% by weight of the resin composition: 45-70 wt % of a base resin, 20-45 wt % of a chopped glass fiber, 1-3 wt % of a toughening resin, 0.2-0.5 wt % of an unmodified glycidyl methacrylate, and 0-10 wt % of an auxiliary. The base resin is selected from the PBT resin and/or the PPS resin. The chopped glass fiber has a dielectric constant of 4.0 to 4.4 at 1 MHz. With the same base resin component, the dielectric constant and dielectric loss of the low-dielectric resin material prepared with the low-dielectric resin composition are significantly reduced, which is advantageous for satisfying the requirements of use of plastics for antenna channels in metal shell of an electronic device, so as to improve the ability of the electronic device having antennas to receive and transmit signals.
    Type: Application
    Filed: March 28, 2018
    Publication date: July 16, 2020
    Applicant: BYD COMPANY LIMITED
    Inventors: Qing GONG, Wei ZHOU, Xiong ZHANG, Yue YU, Renlan SHI