Abstract: The present disclosure provides a display device. A solar cell module is integrated into a body of the display device. A photosensitive control module is configured to detect a brightness value of current ambient light being incident on the display device, and when the detected brightness value meets a predetermined condition, switch a power supply of the display device from a local cell to the solar cell module, so as to supply the electric energy stored in the solar cell module to the display device.

Abstract: The present invention provides an OLED panel, a packaging method thereof and a display device. The OLED panel includes a packaging coverplate and an OLED substrate opposite to each other, the OLED substrate having a display area and a packaging area surrounding the display area; and glass glue provided between the packaging coverplate and the OLED substrate and corresponding to the packaging area, and the OLED panel further includes a support structure provided at a side of the glass glue away from the display area, the support structure being used for supporting the packaging coverplate and the OLED substrate when cutting a display motherboard to form the OLED panel.

Abstract: The present disclosure provides a packaging method, a display panel, and a display device. The packaging method includes forming a glass adhesive on a packaging area of an OLED array substrate or on a packaging cover plate, aligning the packaging cover plate with the OLED array substrate, and applying, from a side of the packaging cover plate facing away from the OLED array substrate a laser to the glass adhesive, to sinter the glass adhesive, wherein the packaging method further includes forming a barrier layer on the packaging cover plate, the barrier layer being configured to block the laser from irradiating an OLED device on the OLED array substrate when the laser irradiates the glass adhesive.

Abstract: A dielectric layer applicable to a display substrate, comprises at least one metal grain layer which is disposed therein. A display substrate comprising the dielectric layer, and a method for manufacturing such a display substrate are further disclosed.

Abstract: The present application discloses a light emitting diode, comprising a pixel unit comprising at least a first sub-pixel in a first region, a second sub-pixel in a second region and a third sub-pixel in a third region; a first electrode layer comprising a first sub-electrode for driving the first sub-pixel, a second sub-electrode for driving the second sub-pixel, and a third sub-electrode for driving the third sub-pixel; a second electrode layer opposite to the first electrode layer; and a light emitting unit between the first electrode layer and the second electrode layer. The light emitting unit comprises a first light emitting layer in the first sub-pixel for emitting light of a first color; a second light emitting layer in the second sub-pixel for emitting light of a second color; and a third light emitting layer in the third sub-pixel for emitting light of a third color. The second light emitting layer is in a same layer as the first light emitting layer.

Abstract: An organic light emitting device includes: a substrate (200), and a first electrode layer (201), a second electrode layer (202), a color conversion layer (206), a first light emitting layer (203), and a second light emitting layer (204) that are stacked on the substrate (200), wherein the first light emitting layer (203) is disposed between the first electrode layer (201) and the second electrode layer (202), the first light emitting layer (203) emits the first emission light under electric excitation; the first electrode layer (201) is a transparent electrode layer, the first color conversion layer (206) is disposed at one side of the first electrode layer (201) away from the second electrode layer (202); the second light emitting layer (204) is disposed between the first light emitting layer (203) and the second electrode layer (202), the second light emitting layer (204) emits the second emission light under electric excitation; and a peak wavelength of the first emission light is larger than a peak wavele

Abstract: The present invention provides a packaging method for an electronic device, which includes a step of forming a packaging substrate, the step of the forming a packaging substrate includes: forming, on a base substrate, a defining pattern which comprises a groove for defining position of frit; providing colloidal frit in the groove; presintering the colloidal frit to obtain preliminarily cured frit; polishing upper surfaces of the defining pattern and the preliminarily cured frit; and removing the defining pattern, and completely curing the preliminarily cured frit, so as to form solid frit on the base substrate. The present invention also provides a packaging system. By using the packaging method provided by the present invention, a better packaging effect can be achieved.

Abstract: The present invention provides an OLED panel, a packaging method thereof and a display device. The OLED panel includes a packaging coverplate and an OLED substrate opposite to each other, the OLED substrate having a display area and a packaging area surrounding the display area; and glass glue provided between the packaging coverplate and the OLED substrate and corresponding to the packaging area, and the OLED panel further includes a support structure provided at a side of the glass glue away from the display area, the support structure being used for supporting the packaging coverplate and the OLED substrate when cutting a display motherboard to form the OLED panel.

Abstract: The present disclosure provides a display device. A solar cell module is integrated into a body of the display device. A photosensitive control module is configured to detect a brightness value of current ambient light being incident on the display device, and when the detected brightness value meets a predetermined condition, switch a power supply of the display device from a local cell to the solar cell module, so as to supply the electric energy stored in the solar cell module to the display device.

Abstract: The present invention provides a packaging method for an electronic device, which includes a step of forming a packaging substrate, the step of the forming a packaging substrate includes: forming, on a base substrate, a defining pattern which comprises a groove for defining position of frit; providing colloidal frit in the groove; presintering the colloidal frit to obtain preliminarily cured frit; polishing upper surfaces of the defining pattern and the preliminarily cured frit; and removing the defining pattern, and completely curing the preliminarily cured frit, so as to form solid frit on the base substrate. The present invention also provides a packaging system. By using the packaging method provided by the present invention, a better packaging effect can be achieved.

Abstract: The present invention discloses a method and a system of flattening a surface formed by sealant of a packaging cover plate, as well as a packaging method, the method includes vibrating a high temperature sintered packaging cover plate by using a high frequency vibrator with a preset frequency, and irradiating the surface formed by sealant of the packaging cover plate by using a laser with preset power, so that a convex portion formed by the sealant is melted and flows to a concave portion formed by the sealant under vibration of the high frequency vibrator, thereby flattening the surface formed by sealant of the packaging cover plate.