Abstract: A fire smoke-detection method and detector based on particle shape characteristics for detecting particles in an optical dark chamber. An optical path angle between one blue light and one infrared light and a photoelectric conversion module is an acute angle, while an optical path angle between another blue light and the photoelectric conversion module is an obtuse angle. The detection method includes: starting a light source combination, calculating a change value between a current scattered light optical power and a background value of each light source, when the change value exceeds a set threshold, continuously starting the light source combination and constructing a space vector from the recorded change values, and using a classifier to classify a plurality of space vectors to obtain a plurality of classification results with categories including fire smoke and interfering aerosols; and counting the classification results to obtain the correct classification result.

Abstract: Consistent with the present disclosure, a package is provided that includes a housing having a recessed portion to accommodate an integrated circuit or chip. The housing has an inner periphery that defines or delineates the recessed portion. The inner periphery may be stepped and includes first and second surfaces that are spaced vertically from one another and extend in respective parallel planes, for example, to thereby constitute first and second shelves. First bonding pads or contacts (“housing pads”) may be provided on the first surface, which may electrically connect or interconnect with first pads on the integrated circuit (“IC pads”), and second housing pads may be provided on the second surface, which can electrically connect or interconnect with second IC pads. Thus, the IC pads connect to corresponding housing pads on the inner periphery of the housing that are above and below one another.

Abstract: Consistent with the present disclosure, a package is provided that includes a housing having a recessed portion to accommodate an integrated circuit or chip. The housing has an inner periphery that defines or delineates the recessed portion. The inner periphery may be stepped and includes first and second surfaces that are spaced vertically from one another and extend in respective parallel planes, for example, to thereby constitute first and second shelves. First bonding pads or contacts (“housing pads”) may be provided on the first surface, which may electrically connect or interconnect with first pads on the integrated circuit (“IC pads”), and second housing pads may be provided on the second surface, which can electrically connect or interconnect with second IC pads. Thus, the IC pads connect to corresponding housing pads on the inner periphery of the housing that are above and below one another.