Patents by Inventor Renzhen WANG

Renzhen WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11887311
    Abstract: Embodiments of this disclosure include a method and an apparatus for segmenting a medical image. The method may include obtaining a slice pair comprising two slices and performing feature extraction on each slice in the slice pair, to obtain high-level feature information and low-level feature information of the each slice in the slice pair. The method may further include segmenting a target object in the each slice according to the low-level feature information and the high-level feature information of the slice, to obtain an initial segmentation result of the each slice and fusing the low-level feature information and the high-level feature information of the slices to obtain a fused feature information. The method may further include determining correlation information between the slices according to the fused feature information and generating a segmentation result of the slice pair based on the correlation information and the initial segmentation results of the slices.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: January 30, 2024
    Assignee: Tencent Technology (Shenzhen) Company Limited
    Inventors: Shilei Cao, Renzhen Wang, Kai Ma, Yefeng Zheng
  • Publication number: 20210365717
    Abstract: Embodiments of this disclosure include a method and an apparatus for segmenting a medical image. The method may include obtaining a slice pair comprising two slices and performing feature extraction on each slice in the slice pair, to obtain high-level feature information and low-level feature information of the each slice in the slice pair. The method may further include segmenting a target object in the each slice according to the low-level feature information and the high-level feature information of the slice, to obtain an initial segmentation result of the each slice and fusing the low-level feature information and the high-level feature information of the slices to obtain a fused feature information. The method may further include determining correlation information between the slices according to the fused feature information and generating a segmentation result of the slice pair based on the correlation information and the initial segmentation results of the slices.
    Type: Application
    Filed: July 29, 2021
    Publication date: November 25, 2021
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Shilei CAO, Renzhen WANG, Kai MA, Yefeng ZHENG