Abstract: Photonically steered impedance surface antennas are disclosed. A disclosed example apparatus includes a semiconductor substrate to be communicatively coupled to a radio frequency (RF) source, an at least partially transparent dielectric layer, the semiconductor substrate at a first side of the at least partially transparent dielectric layer, an at least partially transparent conductive film at a second side of the at least partially transparent dielectric layer that is opposite the first side of the at least partially transparent dielectric layer, and an illumination source to illuminate at least a portion of the semiconductor substrate to generate a photoinduced solid-state plasma pattern that beam steers an RF signal corresponding to the RF source.

Abstract: A radiofrequency frontend device includes a memory array, which includes a plurality of input lines; a plurality of output lines; and a plurality of impedance devices, each impedance device connecting an input line of the plurality of input lines to an output line of the plurality of output lines, wherein each impedance represents a filter coefficient; wherein the radiofrequency frontend device is configured to provide at each input line of the plurality of input lines a sampled voltage of an analog electric signal, each sampled voltage corresponding to a voltage of the analog electric signal during a respective time period of a plurality of time periods; and when the memory array receives the sampled voltages, the memory array is configured to modify each of the sampled voltages by a respective impedance device of the plurality of impedance devices and sum the modified sampled voltages.

Abstract: Systems, apparatuses and methods may provide for technology that includes a capacitor ladder, a plurality of memory cells coupled to the capacitor ladder, the plurality of memory cells to control the capacitor ladder to conduct multi-bit multiply accumulate (MAC) operations during a computation phase, and a successive approximation register (SAR) coupled to the capacitor ladder, the SAR to control the capacitor ladder to digitize results of the multi-bit MAC operations during a digitization phase.

Abstract: A package-to-package communication system is provided including a first package having integrated on a first substrate a first antenna, a second antenna, and a first transceiver coupled to the first antenna and the second antenna. The first antenna is arranged along a first edge of the first substrate. The second antenna is arranged along a second edge of the first substrate. A second package having integrated on a second substrate a third antenna, a fourth antenna and a second transceiver coupled to the third antenna and the fourth antenna. The third antenna is arranged along a third edge of the second substrate. The fourth antenna is arranged along a fourth edge of the second substrate. The first antenna and the third antenna are configured to communicate signals of a vertical polarization. The second antenna and the fourth antenna are configured to communicate signals of a horizontal polarization.

Abstract: The present disclosure relates to a device which includes a processor configured to: select, using sensor data, an error correction code from two or more error correction codes, the sensor data representing a physical state of the processor and/or the device; generate channel-coded data by channel-coding input data using the selected error correction code; and provide a representation of the channel-coded data to a transmitter for wireless data transmission.

Abstract: A communication system, including a first carrier and a first antenna mounted on the first carrier; a second carrier and a second antenna mounted on the second carrier, wherein the first antenna and the second antenna are arranged relative to each other that the first antenna and the second antenna can establish wireless link; a third carrier and a third antenna mounted on the third carrier; a fourth carrier and a fourth antenna mounted on the fourth carrier, wherein the third antenna and the fourth antenna are arranged relative to each other that the third antenna and the fourth antenna can establish wireless link; and a transmission structure, within which the signal propagate through, connects the second antenna and the third antenna.

Abstract: Systems, apparatuses and methods include technology that executes, with a compute-in-memory (CiM) element, first computations based on first data associated with a workload, and a storage of the first data, executes, with a compute-near memory (CnM) element, second computations based on second data associated with the workload and executes, with a compute-outside-of-memory (CoM) element, third computations based on third data associated with the workload. The technology further receives, with a multiplexer, processed data from a first element of the CiM element, the CnM element and the CoM element, and provides, with the multiplexer, the processed data to a second element of the CiM element, the CnM element and the CoM element.

Abstract: Systems, apparatuses and methods include technology that identifies workload numbers associated with a workload. The technology converts the workload numbers to block floating point numbers based on a division of mantissas of the workload numbers into sub-words and executes a compute-in memory operation based on the sub-words to generate partial products.

Abstract: In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.

Abstract: Systems, apparatuses and methods may provide for chip technology including a memory structure having stored weights associated with a machine learning (ML) model, a plurality of digital temperature sensors to generate readings, and a classification engine to retrieve the stored weights from the memory structure and adjust the readings from the plurality of digital temperature sensors based on the weights and electrical parameters associated with the chip.

Abstract: Systems, apparatuses and methods may provide for technology that includes a memory array to store multibit weight data and a capacitor ladder network to conduct multiply-accumulate (MAC) operations on first analog signals and multibit weight data, the capacitor ladder network further to output second analog signals based on the MAC operations, wherein the capacitor ladder network is external to the memory array. In one example, the capacitor ladder network includes a plurality of switches and the logic includes a controller to selectively activate the plurality of switches based on a data format of the multibit weight data.

Abstract: Systems, apparatuses and methods may provide for technology that includes a plurality of analog to digital converters (ADCs), compute-in-memory (CiM) multiply-accumulate (MAC) hardware coupled to the plurality of ADCs, and a plurality of digital to analog converters (DACs) coupled to the CiM MAC hardware, wherein the plurality of DACs includes one or more redundant DACs. In one example, the technology uses a DAC disconnect scheme to statically bypass defective memory bitcells and compute capacitors to improve yield with minimal overhead, and dynamically boost the effective precision of the ADC in the presence of weight/activation sparsity in neural network (NN) compute.

Abstract: Systems, apparatuses and methods may provide for compute-in-memory (CiM) accelerator technology that includes a multiply-accumulate (MAC) computation stage, an analog amplifier stage coupled to an output of the MAC computation stage, and an analog to digital conversion (ADC) stage coupled to an output of the analog amplifier stage, wherein a gain setting of the analog amplifier stage modifies a quantization granularity of the ADC stage.

Abstract: Provided is a dual-agonist compound for both Glucagon-like Peptide-1 (GLP-1) and Glucose-dependent Insulinotropic Polypeptide (GIP) receptors and application thereof. In particular, provided are a polypeptide analog derived from GLP-1 and a pharmaceutically acceptable salt thereof, which has an agonist effect on human GLP-1 receptor and human GIP receptor and can be used for the treatment of metabolic diseases such as obesity, type II diabetes, and non-alcoholic fatty liver.

Abstract: Various embodiments provide systems, devices, and methods for an antenna assembly included in an integrated circuit (IC) package. The antenna assembly may be used for near field wireless communication such as package-to-package and/or chip-to-chip communication. The antenna assembly may include a feed plate (e.g., a top feed) that is capacitively coupled to a first via and a second via. The feed plate may further be capacitively coupled to a loading structure. The first via may be conductively coupled to a ground potential. In some embodiments, the antenna assembly may further include a stub structure (e.g., an open stub or a short stub) that is conductively coupled to the second via. An impedance matching network may be coupled between the feed plate and an IC die that communicates using the antenna assembly. Other embodiments may be described and claimed.

Abstract: Various embodiments provide apparatuses, systems, and methods for multibit analog representation, e.g., for in-memory computing. Embodiments may include a single-ended or differential ladder network to generate an analog value (e.g., a voltage or charge) based on a set of bits from a memory array. The ladder network may include a plurality of branches coupled to an output line, wherein individual branches include a capacitor with a first terminal coupled to the output line and a switch coupled to a second terminal of the capacitor. The switch may be controlled by a respective bit of the set of bits to selectively couple the second terminal of the capacitor to a first voltage node or a second voltage node based on a value of the respective bit. Other embodiments may be described and claimed.

Abstract: Technology for generating an SRAM-based in-memory computing macro includes replacing a SRAM cell cluster defined by a generic SRAM macro with a single-bit multi-bank cluster, the single-bit multi-bank cluster including a plurality of CiM SRAM cells and a plurality of C-2C capacitor ladder cells, arranging a plurality of single-bit multi-bank clusters to form a multi-bit multi-bank cluster, and arranging a plurality of multi-bit multi-bank clusters into a multi-dimensional MAC computational unit within a region of the generic SRAM macro, where an output of at least two of the multi-bit multi-bank clusters are electrically coupled to form an output analog activation line, and where a plurality of bit lines and a plurality of word lines remain at the same grid locations as provided in the generic SRAM macro. Embodiments include arranging a plurality of multi-dimensional MAC computational units into an in-memory MAC computing array.

Abstract: Systems, apparatuses, and methods include technology that identifies that a first memory cell of a plurality of memory cells stores data that is associated with a multiply-accumulate operation. The plurality of memory cells is associated with a multiply-accumulator (MAC). The technology executes a connection operation to electrically connect the first memory cell to the MAC to execute the multiply-accumulate operation. A second memory cell of the plurality of memory cells is electrically disconnected from the MAC during the multiply-accumulate operation. The technology executes, with the MAC, the multiply-accumulate operation based on the data.

Abstract: A package substrate may include a circuit and a leaky surface wave launcher. The circuit may perform engineering tests and end-user operations using sideband signals. The leaky surface wave launcher may perform near field wireless communication. The leaky surface wave launcher may include a via and a strip line. The via may be electrically coupled to the circuit. The via may provide the sideband signals to and receive the sideband signals from the circuit. The strip line may be electrically coupled to the via. The strip line may be excited by the sideband signals to wirelessly couple the leaky surface wave launcher with an external device. The strip line and the via may be unbalanced such that the strip line generates a leaky wave that propagates at least a portion of the package substrate and an environment proximate the package substrate.

Abstract: A transceiver may include a transmitter device, a receiver device, a secondary receiver device, and switching elements. The transmitter device may provide a transmit control signal on first and second channels. The receiver device may receive a receive control signal on the first and second channels. The secondary receiver device may monitor occupation of the first and second channels without decoding at least a portion of control signals concurrent with the receiver device receiving the receive control signal. The switching elements may control when the transmitter device provides the transmit control signal to one of and is electrically isolated from first and second antennas, the receiver device receives the receive control signal from one of and is electrically isolated from the first and second antennas, and the secondary receiver device monitors occupation of one of the first and second channels and is electrically isolated from the first and second antennas.