Patents by Inventor Renzhong PIAO

Renzhong PIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240038427
    Abstract: A superconducting coil device according to one embodiment of the present invention includes: A superconducting coil device including: a bobbin having a tubular body; superconducting wires, a part of which constitutes a wound portion where the superconducting wires are wound on the bobbin; a bobbin-side guide portion holding the superconducting wires extending from the bobbin, the bobbin-side guide portion being provided to extend in a bobbin axial direction, which is an axial direction of the body of the bobbin; a first guide portion holding the superconducting wires extending from the bobbin-side guide portion, the first guide portion being arranged on an outer side of the bobbin-side guide portion in a direction intersecting the bobbin axial direction and provided to extend in the direction intersecting the bobbin axial direction; and a second guide portion capable of holding the superconducting wires extending from the first guide portion, the second guide portion being provided to extend in a direction in
    Type: Application
    Filed: October 11, 2021
    Publication date: February 1, 2024
    Applicants: JAPAN SUPERCONDUCTOR TECHNOLOGY INC., RIKEN, SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Masatoshi YOSHIKAWA, Yasuyuki MIYOSHI, Mamoru HAMADA, Kazuyoshi SAITO, Yoshinori YANAGISAWA, Renzhong PIAO, Kotaro OHKI, Takashi YAMAGUCHI, Tatsuoki NAGAISHI
  • Patent number: 11777269
    Abstract: Provided is a connection body of high-temperature superconducting wire materials including a first oxide high-temperature superconducting wire material and a second oxide high-temperature superconducting wire material, characterized in that a first superconducting layer of the first oxide high-temperature superconducting wire material and a second superconducting layer of the second oxide high-temperature superconducting wire material are bonded together via a junction including M-Cu—O (wherein M is a single metal element or a plurality of metal elements included in the first superconducting layer or the second superconducting layer). The connection body may be, for example, a connection body of Bi2223 wire materials, and the junction may include CaCuO2.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: October 3, 2023
    Assignee: RIKEN
    Inventors: Xinzhe Jin, Yoshinori Yanagisawa, Renzhong Piao, Yu Suetomi
  • Publication number: 20200106229
    Abstract: Provided is a connection body of high-temperature superconducting wire materials including a first oxide high-temperature superconducting wire material and a second oxide high-temperature superconducting wire material, characterized in that a first superconducting layer of the first oxide high-temperature superconducting wire material and a second superconducting layer of the second oxide high-temperature superconducting wire material are bonded together via a junction including M-Cu—O (wherein M is a single metal element or a plurality of metal elements included in the first superconducting layer or the second superconducting layer). The connection body may be, for example, a connection body of Bi2223 wire materials, and the junction may include CaCuO2.
    Type: Application
    Filed: May 22, 2019
    Publication date: April 2, 2020
    Applicant: RIKEN
    Inventors: Xinzhe JIN, Yoshinori YANAGISAWA, Renzhong PIAO, Yu SUETOMI