Patents by Inventor Reshmi Banerjee

Reshmi Banerjee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250185264
    Abstract: A capacitor may include a substrate may include a cavity. The capacitor may include a plurality of particles disposed within the cavity. The capacitor may include a first metal layer, deposited on the substrate, within the cavity, and on the plurality of particles. The capacitor may include a dielectric layer, deposited on the first metal layer. The capacitor may include a second metal layer, deposited on the dielectric layer. The capacitor may include a third metal layer, deposited on the second metal layer such that the cavity is substantially filled.
    Type: Application
    Filed: November 30, 2023
    Publication date: June 5, 2025
    Applicants: Applied Materials, Inc., The Florida International University Board of Trustees
    Inventors: Reshmi Banerjee, Markondeyaraj Pulugurtha, Mudit Sunilkumar Khasgiwala, Meghna Maheshkumar Patel, Kunal Ghosh, Subramani Kengeri, Sachin Jayant Patil, Arvin Khosravi
  • Patent number: 12198855
    Abstract: Cold-sprayed aluminum capacitors on lead frame metal foils are provided for applications in 3D power package integration. This additive manufacturing process allows pre-patterned low-temperature processing of aluminum electrodes on metal lead frames, insulated metal substrates or even heat-spreaders and cold-plates. Cold-sprayed capacitors can eliminate several process integration and reliability issues that are associated with traditional discrete surface-assembled capacitors.
    Type: Grant
    Filed: September 20, 2024
    Date of Patent: January 14, 2025
    Assignee: The Florida International University Board of Trustees
    Inventors: Markondeyaraj Pulugurtha, Arvind Agarwal, Cheng Zhang, Reshmi Banerjee, Denny John
  • Patent number: 12142429
    Abstract: Cold-sprayed aluminum capacitors on lead frame metal foils are provided for applications in 3D power package integration. This additive manufacturing process allows pre-patterned low-temperature processing of aluminum electrodes on metal lead frames, insulated metal substrates or even heat-spreaders and cold-plates. Cold-sprayed capacitors can eliminate several process integration and reliability issues that are associated with traditional discrete surface-assembled capacitors.
    Type: Grant
    Filed: March 26, 2024
    Date of Patent: November 12, 2024
    Assignee: The Florida International University Board of Trustees
    Inventors: Markondeyaraj Pulugurtha, Arvind Agarwal, Cheng Zhang, Reshmi Banerjee, Denny John