Patents by Inventor Reto Weibel

Reto Weibel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220088730
    Abstract: A control panel for a machine tool has a housing (1). The housing comprises a housing base part (2) and a housing front part (3). A display (19) and a control element panel (20, 21) are attached to the front part of the housing. In the region of the housing bottom side, the housing front part is connected to the housing base part by miter hinges so that it can be swiveled to provide access to the interior of the housing. Fold-out supports (13) make it possible to use an alphanumeric keyboard (15) for maintenance work. Indentations (5) on both sides of the housing rear allow the housing to be easily grasped. Control elements (18) are arranged in the indentations.
    Type: Application
    Filed: February 20, 2020
    Publication date: March 24, 2022
    Applicant: REISHAUER AG
    Inventor: Reto WEIBEL
  • Patent number: 9666460
    Abstract: A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connectable to a protective gas source so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to the passage direction and which is bounded by a bottom edge and an upper edge. The transport system comprises at least one clamp for transporting the substrates through the channel. The clamp is movable back and forth along the longitudinal slit of the channel. Such a through-type furnace is in particular suitable for use in a soft solder die bonder.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: May 30, 2017
    Assignee: Besi Switzerland AG
    Inventors: Guido Suter, Kevin Domancich, Daniel Andreas Scherer, Reto Weibel
  • Publication number: 20150136836
    Abstract: A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connectable to a protective gas source so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to the passage direction and which is bounded by a bottom edge and an upper edge. The transport system comprises at least one clamp for transporting the substrates through the channel. The clamp is movable back and forth along the longitudinal slit of the channel. Such a through-type furnace is in particular suitable for use in a soft solder die bonder.
    Type: Application
    Filed: November 20, 2014
    Publication date: May 21, 2015
    Inventors: Guido Suter, Kevin Domancich, Daniel Andreas Scherer, Reto Weibel