Patents by Inventor Reuben J. Chang

Reuben J. Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit device system with elevated configuration and method of manufacture thereof
    Patent number: 10529688
    Abstract: A system and method of manufacture of an integrated circuit device system includes mounting a first elevated device on a first riser positioned adjacent to a base device. The first elevated device includes a first device overhang that extends over the base device. A second elevated device can be mounted on a second riser adjacent to the first riser to allow the attachment of a second elevated device mounted above the first elevated device to achieve higher component densities.
    Type: Grant
    Filed: March 19, 2017
    Date of Patent: January 7, 2020
    Assignee: SMART Modular Technologies, Inc.
    Inventors: Satyanarayan Shivkumar Iyer, Reuben J. Chang, Victor Mahran
  • MEMORY MODULE REPAIR SYSTEM WITH FAILING COMPONENT DETECTION AND METHOD OF OPERATION THEREOF
    Publication number: 20170262337
    Abstract: A memory module repair system, and a method of operation thereof, including: a memory controller; a volatile memory having memory chips coupled to the memory controller, the memory controller for testing the volatile memory; an ECC controller, coupled to the memory controller, for determining a failing bit location information of a failing bit within the volatile memory; and an error log storage coupled to the memory controller and the ECC controller for storing the failing bit location information.
    Type: Application
    Filed: March 10, 2016
    Publication date: September 14, 2017
    Inventors: Reuben J. Chang, Satyanarayan S. Iyer, Michael Rubino
  • Integrated circuit device system with elevated configuration and method of manufacture thereof
    Patent number: 9603252
    Abstract: A system and method of manufacture of an integrated circuit device system includes: a carrier having a first side; a base device mounted on the first side; a first riser mounted on the first side; a second riser mounted on the first side and adjacent to the first riser; a peripheral elevated device mounted on the first riser, the peripheral elevated device having a device overhang above the base device; and an inner elevated device mounted on the second riser, the inner elevated device having the device overhang above the base device.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: March 21, 2017
    Assignee: SMART Modular Technologies, Inc.
    Inventors: Satyanarayan Shivkumar Iyer, Reuben J. Chang, Victor Mahran