Patents by Inventor Reuven Holzer

Reuven Holzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9698299
    Abstract: A device having a plurality of thin film photovoltaic cells (PV) formed over a passivation layer. The device comprises a plurality of thin film photovoltaic (PV) cells formed over the passivation layer, each PV cell includes at least a lower conducting layer (LCL) and an upper conducting layer (UCL); and a conducting path connecting at least a UCL of a first PV cell to at least a LCL of a second PV cell, wherein at least a first array of PV cells comprised of at least a first portion of the plurality of PV cells is connected by the respective UCL and LCL of each PV cell to provide a first voltage output. In an embodiment the passivation layer is formed over a target integrated circuit (TIC), the TIC having a top surface and a bottom surface.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: July 4, 2017
    Assignee: Sol Chip Ltd.
    Inventors: Shani Keysar, Reuven Holzer, Ofer Navon, Ram Friedlander
  • Patent number: 9379543
    Abstract: A system for energy harvesting comprises a first interface for receiving energy from at least one renewable energy source (ERS); a second interface coupled to at least one load circuit; a third interface coupled to an least one primary energy storage (PES); a DC-to-DC converter connected to one of a single inductor and a single capacitor; a switching circuitry connected to the first, second, and third interfaces and the DC-to-DC converter; a control unit connected to the DC-to-DC converter and the switching circuitry, the control unit controls the system to operate in an operation mode including any one of: provide energy from the ERS to the at least one load via the DC-to-DC converter, charge the least one PES from the at least one ERS via the DC-to-DC converter, and provide energy from the at least one PES to the at least one load circuit via the DC-to-DC converter.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: June 28, 2016
    Assignee: Sol Chip Ltd.
    Inventors: Shani Keysar, Reuven Holzer, Rami Friedlander
  • Publication number: 20150111320
    Abstract: A device having a plurality of thin film photovoltaic cells (PV) formed over a passivation layer. The device comprises a plurality of thin film photovoltaic (PV) cells formed over the passivation layer, each PV cell includes at least a lower conducting layer (LCL) and an upper conducting layer (UCL); and a conducting path connecting at least a UCL of a first PV cell to at least a LCL of a second PV cell, wherein at least a first array of PV cells comprised of at least a first portion of the plurality of PV cells is connected by the respective UCL and LCL of each PV cell to provide a first voltage output. In an embodiment the passivation layer is formed over a target integrated circuit (TIC), the TIC having a top surface and a bottom surface.
    Type: Application
    Filed: December 23, 2014
    Publication date: April 23, 2015
    Applicant: Sol Chip, Ltd.
    Inventors: Shani KEYSAR, Reuven HOLZER, Ofer NAVON, Ram FRIEDLANDER
  • Patent number: 8952473
    Abstract: A target integrated circuit (TIC) having a top conductive layer (TCL) that may be connected to a plurality of cells that are further integrated over the TIC. Each of the plurality of cells comprises two conductive layers, a lower conductive layer (LCL) below the cell and an upper conductive layer (UCL) above the cell. Both conductive layers may connect to the TCL of the TIC to form a super IC structure combined of the TIC and the plurality of cells connected thereto. Accordingly, conductivity between the TIC as well as auxiliary circuitry to the TIC maybe achieved.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: February 10, 2015
    Assignee: Sol Chip Ltd.
    Inventors: Shani Keysar, Reuven Holzer, Ofer Navon, Rami Friedlander
  • Patent number: 8921967
    Abstract: An integrated circuit (IC) combination of a target integrated circuit (TIC) and a plurality of thin film photovoltaic cells (PV) connected thereto. The IC comprises a target integrated circuit (TIC) having a top surface and a bottom surface; a plurality of thin film photovoltaic (PV) cells formed over at least one of the top surface and the bottom surface of the TIC, each PV cell includes at least a lower conducting layer (LCL) and an upper conducting layer (UCL); and a conducting path connecting at least a UCL of a first PV cell to at least a LCL of a second PV cell, wherein at least a first array of PV cells comprised of at least a first portion of the plurality of PV cells is connected by the respective UCL and LCL of each PV cell to provide a first voltage output.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: December 30, 2014
    Assignee: Sol Chip Ltd.
    Inventors: Shani Keysar, Reuven Holzer, Ofer Navon, Ram Friedlander
  • Publication number: 20130264870
    Abstract: A system for energy harvesting comprises a first interface for receiving energy from at least one renewable energy source (ERS); a second interface coupled to at least one load circuit; a third interface coupled to an least one primary energy storage (PES); a DC-to-DC converter connected to one of a single inductor and a single capacitor; a switching circuitry connected to the first, second, and third interfaces and the DC-to-DC converter; a control unit connected to the DC-to-DC converter and the switching circuitry, the control unit controls the system to operate in an operation mode including any one of: provide energy from the ERS to the at least one load via the DC-to-DC converter, charge the least one PES from the at least one ERS via the DC-to-DC converter, and provide energy from the at least one PES to the at least one load circuit via the DC-to-DC converter.
    Type: Application
    Filed: March 14, 2013
    Publication date: October 10, 2013
    Applicant: SOL CHIP LTD.
    Inventors: Shani Keysar, Reuven Holzer, Rami Friedlander
  • Publication number: 20120085385
    Abstract: An integrated circuit (IC) combination of a target integrated circuit (TIC) and a plurality of thin film photovoltaic cells (PV) connected thereto. The IC comprises a target integrated circuit (TIC) having a top surface and a bottom surface; a plurality of thin film photovoltaic (PV) cells formed over at least one of the top surface and the bottom surface of the TIC, each PV cell includes at least a lower conducting layer (LCL) and an upper conducting layer (UCL); and a conducting path connecting at least a UCL of a first PV cell to at least a LCL of a second PV cell, wherein at least a first array of PV cells comprised of at least a first portion of the plurality of PV cells is connected by the respective UCL and LCL of each PV cell to provide a first voltage output.
    Type: Application
    Filed: December 19, 2011
    Publication date: April 12, 2012
    Applicant: SOL CHIP, LTD.
    Inventors: Shani Keysar, Reuven Holzer, Ofer Navon, Ram Friedlander
  • Publication number: 20120025342
    Abstract: A target integrated circuit (TIC) having a top conductive layer (TCL) that may be connected to a plurality of cells that are further integrated over the TIC. Each of the plurality of cells comprises two conductive layers, a lower conductive layer (LCL) below the cell and an upper conductive layer (UCL) above the cell. Both conductive layers may connect to the TCL of the TIC to form a super IC structure combined of the TIC and the plurality of cells connected thereto. Accordingly, conductivity between the TIC as well as auxiliary circuitry to the TIC maybe achieved.
    Type: Application
    Filed: October 11, 2011
    Publication date: February 2, 2012
    Applicant: Sol Chip Ltd.
    Inventors: Shani Keysar, Reuven Holzer, Ofer Navon, Ram Friedlander
  • Patent number: 5656960
    Abstract: A controlled-slope output buffer is furnished to reduce electro-magnetic interference (EMI) and ground bounce noise which commonly arises in output buffers in a VLSI chip. In the controlled-slope buffer, output current pulses are shaped to reduce higher frequency signal components. Corrective shaping of the electrical signals by the controlled-slope buffer is effective in reducing EMI emissions in a frequency range from 200 to 1000 MHz. Output signals of the controlled-slope output buffer have voltage slopes which are substantially the same as output signals generated by conventional output buffers. However, the controlled-slope output buffer generates output signals in which the shape of the current pulse is greatly improved for reducing EMI and ground bounce noise. In the controlled-slope buffers according to the present invention, current pulses have a triangular shape when they are drawn in the time domain.
    Type: Grant
    Filed: May 30, 1995
    Date of Patent: August 12, 1997
    Assignee: National Semiconductor Corporation
    Inventor: Reuven Holzer
  • Patent number: 5614851
    Abstract: An accurate peak-to-peak detector, readily implemented in CMOS and consuming low power. The peak-to-peak detector includes a clamp portion (circuit) followed by a peak-detect portion (circuit), each of which circuits includes at least one active component (e.g., transistor). The clamp circuit receives an input signal having an alternating current (AC) component via an input coupling capacitor which outputs a voltage on a line to the peak-detect circuit. The clamp circuit includes either a passive load element (e.g., a resistor), or an active load element (e.g., a CMOS transistor), so that the clamp circuit bleeds current from the input coupling capacitor, and any slow drift in the DC level of the input voltage will be followed. The peak-detect circuit follows the voltage output by the coupling capacitor, and includes either a passive load element (e.g., a resistor) or an active load element (e.g.
    Type: Grant
    Filed: February 9, 1995
    Date of Patent: March 25, 1997
    Assignee: National Semiconductor Corporation
    Inventors: Reuven Holzer, Rafael Fried
  • Patent number: 5594390
    Abstract: An active filter includes a capacitor and a resistor coupled in parallel to an input terminal; a first current conveyor coupled between the capacitor and an output terminal; a second current conveyor coupled between the resistor and the output terminal; and a second capacitor coupled between the output terminal and ground. Proportionality constants between input and output currents of the current conveyors can be adjusted to reduce capacitance in the active filter and reduce the area required to fabricate the active filter in an integrated circuit. The active filter can replace a conventional loop filter in a phase-locked loop of a data separator integrated circuit. In a phase-locked loop, the polarity of a charge pump can be reversed to compensate for current reversal by the current conveyors in the active filter.
    Type: Grant
    Filed: November 27, 1995
    Date of Patent: January 14, 1997
    Assignee: National Semiconductor Corporation
    Inventor: Reuven Holzer
  • Patent number: 5568093
    Abstract: A power efficient class A-B amplifier provides 20 dB amplification for a low capacitive load such as a 40 to 80 MHz clock signal in a crystal oscillator circuit. The amplifier includes two bias-and-clamp circuits coupled between an input stage and the gates of an N-channel transistor and a P-channel transistor. The N-channel and P-channel transistors are connected in series between VCC and ground and form an output stage. The bias-and-clamp circuits bias the N-channel and P-channel transistors in weak inversion for maximum amplification and clamp an input voltage to increase noise immunity and reduce power use. In one embodiment, each bias-and-clamp circuit includes two pairs of series connected transistors. A first pair is connected in series with a constant current source and form current mirrors with a second pair of transistors. A node between transistors in the second pair is connected to the gate of a transistor in the output stage and to the input voltage.
    Type: Grant
    Filed: May 18, 1995
    Date of Patent: October 22, 1996
    Assignee: National Semiconductor Corporation
    Inventor: Reuven Holzer