Patents by Inventor Revathi Polisetti

Revathi Polisetti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of Making Multi-Chip Package with High-Speed Serial Communications between Semiconductor Dice
    Publication number: 20080113471
    Abstract: A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
    Type: Application
    Filed: January 10, 2008
    Publication date: May 15, 2008
    Applicant: Citicorp North America, Inc.
    Inventors: Michael Kelly, Paul Chenard, Revathi Polisetti, Patrick McKinley
  • Multi-chip package with high-speed serial communications between semiconductor die
    Publication number: 20050248036
    Abstract: A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
    Type: Application
    Filed: May 7, 2004
    Publication date: November 10, 2005
    Inventors: Michael Kelly, Paul Chenard, Revathi Polisetti, Patrick McKinley