Abstract: Methods and devices for insulating electronic devices are disclosed. The devices include a jacket comprising an absorbing material wetted with a liquid cooling-agent. When the jacket is introduced into a heated process-environment, the liquid cooling-agent evaporates and cools the jacket. The absorbing material can comprise a heat-resistant, organic, polymeric material, such as a network of polyimide fibers.

Abstract: The concentration of solvent in a fluid including solvent and aqueous components is gradually decreased while the fluid is in contact with the electronic assemblies to be cleaned. An apparatus for cleaning electronic assemblies has a fluid supply tank containing emulsifiable fluids and a wash chamber containing the electronic assemblies. A fluid circuit includes a supply pump and a supply line for providing fluid from the tank to the chamber, and a valve drain line for returning fluid to the chamber to the pump. A sprayer within the chamber uses a separate sprayer pump for spraying fluid collected within the chamber onto the assemblies. The supply pump is connected to the supply tank at an intermediate level such that it initially draws off all of the uppermost, lightest fluid layer, and only a portion of the lower fluid. Consequently, the initial wash includes a higher solvent concentration than in later wash stages, when all fluid is uniformly mixed.

Abstract: The present invention is an apparatus to clean and cleanliness test printed circuit wiring boards and includes an inner chamber and an outer enclosure encasing the inner chamber. A rack within the chamber is adapted to hold a plurality of PCBs having electronic components assembled thereon. An operator programmable microprocessor controller causes a saponifier solution to be introduced into the interior chamber. The saponifier solution is pumped through a diffusion assembly in the chamber to spray the solution onto the PCBs. Upon completion of this cleaning cycle, the saponifier solution is drained by gravity out of the chamber. This is followed by a water rinsing cycle utilizing the same hardware and procedure. Once the rosin saponification cleaning cycle and water rinsing cycle are complete, the system controller empties the wash chamber and pumps in a standard resistivity test mixture of 75% isopropyl alcohol (IPA) and 25% water. A MIL-P-28809 cleanliness test is then performed on the PCBs.

Abstract: A cleaning apparatus and method for washing and rinsing electronic assemblies. The apparatus includes a single closable chamber for containing a single tank with attached ultrasonic transducers. Separate wash and rinse fluid circuits each are arranged to fill the tank, to drain fluid from the tank, and to recondition the fluid for reuse. To permit the safe use of combustible solvents, an inert gas purge system evacuates oxygen and combustible vapors from areas with potential electrical ignition sources.

Abstract: A batch cleaning system which can use a combustible solvent to clean printed circuit boards or other electronic assemblies is disclosed. An inner enclosure is sealed by a door. A rack for supporting printed circuit boards or other electronic assemblies or the like is mounted inside the inner enclosure. A plurality of spray nozzles are mounted within the inner enclosure. The inner enclosure is purged of air by introducing an inert gas. Combustible solvent is introduced into the bottom of the inner enclosure where it is pumped through the spray nozzles to clean the printed circuit boards. The contamination level of the solvent is measured and recorded. The solvent is drained back into a solvent holding tank upon completion of the cleaning cycle for subsequent reuse during the next cleaning cycle.