Abstract: The present invention relates to integrated circuits having symmetric inducting devices with a ground shield. In one embodiment, a symmetric inducting device for an integrated circuit comprises a substrate, a main metal layer and a shield. The substrate has a working surface. The main metal layer has at least one pair of current path regions. Each of the current path region pairs is formed in generally a regular polygonal shape that is generally symmetric about a plane of symmetry that is perpendicular to the working surface of the substrate. The shield is patterned into segments that are generally symmetric about the plane of symmetry. Medial portions of at least some segments of the shield are formed generally perpendicular to the plane of symmetry as the medial portions cross the plane of symmetry.

Abstract: The present invention relates to integrated circuits having symmetric inducting devices with a ground shield. In one embodiment, a symmetric inducting device for an integrated circuit comprises a substrate, a main metal layer and a shield. The substrate has a working surface. The main metal layer has at least one pair of current path regions. Each of the current path region pairs is formed in generally a regular polygonal shape that is generally symmetric about a plane of symmetry that is perpendicular to the working surface of the substrate. The shield is patterned into segments that are generally symmetric about the plane of symmetry. Medial portions of at least some segments of the shield are formed generally perpendicular to the plane of symmetry as the medial portions cross the plane of symmetry.

Abstract: The present invention relates to integrated circuits having symmetric inducting devices with a ground shield. In one embodiment, a symmetric inducting device for an integrated circuit comprises a substrate, a main metal layer and a shield. The substrate has a working surface. The main metal layer has at least one pair of current path regions. Each of the current path region pairs is formed in generally a regular polygonal shape that is generally symmetric about a plane of symmetry that is perpendicular to the working surface of the substrate. The shield is patterned into segments that are generally symmetric about the plane of symmetry. Medial portions of at least some segments of the shield are formed generally perpendicular to the plane of symmetry as the medial portions cross the plane of symmetry.

Abstract: Inducting devices having a patterned ground shield with ribbing in an integrated circuit. In one embodiment, an inducting device comprises conductive turns to conduct current, a shield layer and a plurality of ribs. The shield layer is formed a select distance from the conductive turns. The shield layer is patterned into sections of shield to prevent eddy currents. The plurality of ribs are formed from a conductive layer that is positioned between the conductive turns and shield layer. Each rib is electrically coupled to a single associated section of shield. Moreover, each rib is more conductive than its associated section of shield to provide a less resistive current path than its associated section of shield.

Abstract: The present invention relates to integrated circuits having symmetric inducting devices with a ground shield. In one embodiment, a symmetric inducting device for an integrated circuit comprises a substrate, a main metal layer and a shield. The substrate has a working surface. The main metal layer has at least one pair of current path regions. Each of the current path region pairs is formed in generally a regular polygonal shape that is generally symmetric about a plane of symmetry that is perpendicular to the working surface of the substrate. The shield is patterned into segments that are generally symmetric about the plane of symmetry. Medial portions of at least some segments of the shield are formed generally perpendicular to the plane of symmetry as the medial portions cross the plane of symmetry.

Abstract: Inducting devices having a patterned ground shield with ribbing in an integrated circuit. In one embodiment, an inducting device comprises conductive turns to conduct current, a shield layer and a plurality of ribs. The shield layer is formed a select distance from the conductive turns. The shield layer is patterned into sections of shield to prevent eddy currents. The plurality of ribs are formed from a conductive layer that is positioned between the conductive turns and shield layer. Each rib is electrically coupled to a single associated section of shield. Moreover, each rib is more conductive than its associated section of shield to provide a less resistive current path than its associated section of shield.

Abstract: Inducting devices having a patterned ground shield with ribbing in an integrated circuit. In one embodiment, an inducting device comprises conductive turns to conduct current, a shield layer and a plurality of ribs. The shield layer is formed a select distance from the conductive turns. The shield layer is patterned into sections of shield to prevent eddy currents. The plurality of ribs are formed from a conductive layer that is positioned between the conductive turns and shield layer. Each rib is electrically coupled to a single associated section of shield. Moreover, each rib is more conductive than its associated section of shield to provide a less resistive current path than its associated section of shield.

Abstract: The present invention relates to integrated circuits having symmetric inducting devices with a ground shield. In one embodiment, a symmetric inducting device for an integrated circuit comprises a substrate, a main metal layer and a shield. The substrate has a working surface. The main metal layer has at least one pair of current path regions. Each of the current path region pairs is formed in generally a regular polygonal shape that is generally symmetric about a plane of symmetry that is perpendicular to the working surface of the substrate. The shield is patterned into segments that are generally symmetric about the plane of symmetry. Medial portions of at least some segments of the shield are formed generally perpendicular to the plane of symmetry as the medial portions cross the plane of symmetry.

Abstract: Inducting devices having a patterned ground shield with ribbing in an integrated circuit. In one embodiment, an inducting device comprises conductive turns to conduct current, a shield layer and a plurality of ribs. The shield layer is formed a select distance from the conductive turns. The shield layer is patterned into sections of shield to prevent eddy currents. The plurality of ribs are formed from a conductive layer that is positioned between the conductive turns and shield layer. Each rib is electrically coupled to a single associated section of shield. Moreover, each rib is more conductive than its associated section of shield to provide a less resistive current path than its associated section of shield.

Abstract: The present invention relates to integrated circuits having symmetric inducting devices with a ground shield. In one embodiment, a symmetric inducting device for an integrated circuit comprises a substrate, a main metal layer and a shield. The substrate has a working surface. The main metal layer has at least one pair of current path regions. Each of the current path region pairs is formed in generally a regular polygonal shape that is generally symmetric about a plane of symmetry that is perpendicular to the working surface of the substrate. The shield is patterned into segments that are generally symmetric about the plane of symmetry. Medial portions of at least some segments of the shield are formed generally perpendicular to the plane of symmetry as the medial portions cross the plane of symmetry.

Abstract: The present invention relates to integrated circuits having symmetric inducting devices with a ground shield. In one embodiment, a symmetric inducting device for an integrated circuit comprises a substrate, a main metal layer and a shield. The substrate has a working surface. The main metal layer has at least one pair of current path regions. Each of the current path region pairs is formed in generally a regular polygonal shape that is generally symmetric about a plane of symmetry that is perpendicular to the working surface of the substrate. The shield is patterned into segments that are generally symmetric about the plane of symmetry. Medial portions of at least some segments of the shield are formed generally perpendicular to the plane of symmetry as the medial portions cross the plane of symmetry.

Abstract: An integrated circuit with an inductor structure includes a semiconductor device substrate. Over the semiconductor device substrate is a dielectric layer, and over the dielectric layer is a metal spiral inductor. The metal spiral is formed by a continuous metal strip. The continuous metal strip has at one end a center and then increases in a radial direction to its other end. The metal spiral carries current between its two ends and generates radial and circumferential parasitic currents in the substrate. In the substrate are a plurality of separated radial doped strips about a central axis. Each of these radial doped strips define a region of relative low resistivity to reduce the resistance to the radial current flow in the device substrate. These strips are separated by regions having relatively high resistivity to substantially maintain the resistance to the circumferential current flow in the substrate.