Abstract: The invention includes an interposer, BGA connector, or other connection device that provides electrical contact with a ball grid array connector. The inventive interposer includes a housing with contacts. The contacts have a first end and a second end. The interposer also includes a first body and a second body of reflowable, electrically conductive material disposed on the first end of at least one of the contacts. The first body and the second body provide an electrical contact between the interposer and a single body of reflowable, electrically conductive material of the ball grid array connector.

Abstract: A system and method for mechanically and electrically connecting an electronic component and a circuit substrate using a Zero Insertion Force (ZIF) socket. The ZIF socket having a plurality of press-fit contact assemblies and a housing with middle plate that is selectively movable between a contact and non-contact position. Each contact assembly being secured to the ZIF socket housing by press-fitting the lower portion of the contact assembly such that each contact assembly is anchored to an aperture in the housing bottom by compressive force. The ZIF socket is mounted to the circuit substrate and the electronic component is mounted on to the ZIF socket. The contact assemblies of the ZIF socket are selectively movable between a contact and non-contact position. The press-fit contact assemblies form a seal to prevent solder wick-up.

Abstract: The invention includes an interposer, BGA connector, or other connection device that provides electrical contact with a ball grid array connector. The inventive interposer includes a housing with contacts. The contacts have a first end and a second end. The interposer also includes a first body and a second body of reflowable, electrically conductive material disposed on the first end of at least one of the contacts. The first body and the second body provide an electrical contact between the interposer and a single body of reflowable, electrically conductive material of the ball gid array connector.

Abstract: A system and method for mechanically and electrically connecting an electronic component and a circuit substrate using a Zero Insertion Force (ZIF) socket. The ZIF socket having a plurality of press-fit contact assemblies and a housing with middle plate that is selectively movable between a contact and non-contact position. Each contact assembly being secured to the ZIF socket housing by press-fitting the lower portion of the contact assembly such that each contact assembly is anchored to an aperture in the housing bottom by compressive force. The ZIF socket is mounted to the circuit substrate and the electronic component is mounted on to the ZIF socket. The contact assemblies of the ZIF socket are selectively movable between a contact and non-contact position.

Abstract: A socket assembly comprising a base having a plurality of electrical contacts connectable to a circuit board, and a cover having a plurality of apertures. The cover is movable between a rearward (open) position, and a frontward (closed) position. In the open position, the apertures receive male contacts from an electronic component, for example a pin grid array package, such that the male contacts encounter no frictional resistance to their insertion into the apertures. In the closed position, the male contacts are held in a position of electrical connection with the contacts in the base. As the cover moves from the open to the closed position, it pushes the male contacts and base contacts together in a manner such that the base contacts “wipe” against the male contacts, thus removing debris and contaminants from the electrical contact region.

Abstract: A socket for connecting an electrical component to a circuit substrate is disclosed. The electrical component has a terminal extending along a terminal axis therefrom. The socket includes a base, a contact secured to the base to electrically connect the terminal to the circuit substrate, a cover attached to the base, and an actuator. The contact includes a beam portion elongated along a beam axis, and a contact mating portion flexibly connected to an end of the beam portion and defining a contact plane at an angle with the beam axis. The contact mating portion has a contact aperture therein to receive the terminal. The cover has a lead-in aperture for receiving the terminal and allowing the terminal to enter the contact aperture. The actuator is operatively coupled to the contact, for causing the contact mating portion to rotate and to engage the terminal.

Abstract: A floating terminal connector for use with a circuit substrate having a plurality of elongated conductors. A pin retention structure is axially aligned with through holes on a connector body. A terminal pin passes through the through hole and pin retention structure. An annular projection on the terminal provides a stop to the float travel of the terminal pin in one direction. A head on the terminal pin stops float travel of the terminal pin in the opposite direction.

Abstract: A socket for connecting an electrical component to a circuit substrate is disclosed. The electrical component has a terminal extending along a terminal axis therefrom. The socket includes a base, a contact secured to the base to electrically connect the terminal to the circuit substrate, a cover attached to the base, and an actuator. The contact includes a beam portion elongated along a beam axis, and a mating portion flexibly connected to the beam portion. The mating portion includes a first contact mating element having a first contact aperture, and a second contact mating element that is flexibly connected to the first contact mating element and has a second contact aperture. The cover has a lead-in aperture for receiving the terminal and allowing the terminal to enter one of the contact apertures. The actuator is operatively coupled to the contact, for causing the contact mating elements to rotate and to engage the terminal.

Abstract: A socket for connecting an electrical component to a circuit substrate is disclosed. The electrical component has a terminal extending along a terminal axis therefrom. The socket includes a base, a contact secured to the base to electrically connect the terminal to the circuit substrate, a cover attached to the base, and an actuator. The contact includes a beam portion elongated along a beam axis, and a contact mating portion flexibly connected to an end of the beam portion and defining a contact plane at an angle with the beam axis. The contact mating portion has a contact aperture therein to receive the terminal. The cover has a lead-in aperture for receiving the terminal and allowing the terminal to enter the contact aperture. The actuator is operatively coupled to the contact, for causing the contact mating portion to rotate and to engage the terminal.

Abstract: An integrated circuit carrier system having a carrier frame made up of a plurality of juxtaposed sides and an interior configuration sized to matingly engage an integrated circuit package. The integrated circuit package fits within the frame and is held in position therein by a plurality of locking clips which slidably engage a plurality of top and bottom channels diagonally disposed at each of the corners of the frame. Each locking clip is made up of a substantially C-shaped structure having an uppermost leg and a lowermost leg. The uppermost leg ends in a substantially perpendicularly disposed locking tab and the lowermost leg has a variety of locking arrangements, one of which permits the locking clip to be locked in two locking positions. In one locking position the integrated circuit package is held securely in place while in the other locking position the integrated circuit package may be inserted or removed from the carrier.