Abstract: According to some aspects of the present disclosure, transformers having a screen layer and corresponding methods of winding transformers and are disclosed. Example transformers include at least one transformer core, at least one primary winding layer wound about the transformer core, and at least one secondary winding layer wound about the transformer core. The secondary winding layer includes a secondary winding wire having a width and a number of turns per layer. The transformer also includes at least one screen layer wound about the transformer core and disposed between the primary winding layer and the secondary winding layer. The screen layer includes a screen wire having substantially the same width as the secondary winding wire and substantially the same number of turns per layer as the secondary winding wire, to reduce common mode noise in the secondary winding layer.

Abstract: According to some aspects of the present disclosure, transformers having a screen layer and corresponding methods of winding transformers and are disclosed. Example transformers include at least one transformer core, at least one primary winding layer wound about the transformer core, and at least one secondary winding layer wound about the transformer core. The secondary winding layer includes a secondary winding wire having a width and a number of turns per layer. The transformer also includes at least one screen layer wound about the transformer core and disposed between the primary winding layer and the secondary winding layer. The screen layer includes a screen wire having substantially the same width as the secondary winding wire and substantially the same number of turns per layer as the secondary winding wire, to reduce common mode noise in the secondary winding layer.

Abstract: The present invention is a mounting structure for a power supply. The mounting structure of the present invention allows power to be coupled from a power supply to a predetermined area on a motherboard adjacent one or more high power demand components, such as an IC microprocessor chip. The mounting structure includes a frame; a plurality of legs attached to the frame for supporting the frame on the motherboard; the ends of the legs opposite the frame being attached to the motherboard; a fastener coupled to the frame for releasably fastening the power supply to the mounting structure such that the power supply is positioned a predefined distance above the upper surface of the motherboard; and a plurality of power buses interconnecting the power supply and the motherboard at predetermined area on the motherboard adjacent a high power demand IC chip.