Abstract: A liquid refill fixture for a cooling system is adapted for refilling the cooling system with a coolant from a coolant tank. The liquid refill fixture for a cooling system includes: a liquid refill pump, having a liquid inlet unit; a pipeline group, including a first pipeline and a second pipeline, the first pipeline adapted to be in communication with the liquid inlet unit of the liquid refill pump and the coolant tank, the second pipeline adapted to be in communication with the first pipeline and the coolant tank; an auxiliary pump, disposed at the second pipeline, adapted to drive a fluid in the second pipeline to flow; and a current controller, electrically connected to the auxiliary pump, for providing the auxiliary pump with operating power and controlling an operating time of the auxiliary pump.

Abstract: A heat-pipe type radiator includes a plurality of fins closely arranged side to side and correspondingly provided with at least one first hole, and at least one heat pipe extended through the fins via the at least one hole provided on each fin. Each hole on the fin is provided at an edge with a second hole. A bonding agent is applied via the second holes into the first holes to fill up a clearance in the first holes between the heat pipe and the fins. In this type of radiator, an entire circumferential surface of the heat pipe is in contact with the fins to enable enhanced heat transfer from the heat pipe to the fins. In a method of producing the above-described heat-pipe type radiator, the bonding agent may be a solder paste or a solder stick depending on a shape of the second hole and is heated to a melting point to flow from the second holes into the first holes. After the molten bonding agent is cooled and set, it firmly bonds the heat pipe and the fins together.