Patents by Inventor Reyn Tetsuro WAKABAYASHI

Reyn Tetsuro WAKABAYASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220102117
    Abstract: Embodiments of components for use in substrate process chambers are provided herein. In some embodiments, a component for use in a substrate process chamber includes: a body having an opening extending partially through the body from a top surface of the body, wherein the opening includes a threaded portion for fastening the body to a second process chamber component, wherein the threaded portion includes a plurality of threads defining a plurality of rounded crests and a plurality of rounded roots, and wherein a depth of the threaded portion, being a radial distance between a rounded crest of the plurality of rounded crests and an adjacent root of the plurality of rounded roots, decreases from a first depth to a second depth at a last thread of the plurality of threads.
    Type: Application
    Filed: September 25, 2020
    Publication date: March 31, 2022
    Inventors: Reyn Tetsuro WAKABAYASHI, Carlaton WONG, Timothy Joseph FRANKLIN
  • Publication number: 20220093362
    Abstract: Embodiments of showerheads are provided herein. In some embodiments, a showerhead assembly includes a chill plate comprising a gas plate and a cooling plate having an aluminum-silicon foil interlayer disposed therebetween for diffusion bonding the gas plate to the cooling plate and a heater plate comprising a first plate, a second plate, and a third plate, wherein an aluminum-silicon foil interlayer is disposed between the first plate and the cooling plate for diffusion bonding the first plate to the cooling plate, wherein an aluminum-silicon foil interlayer is disposed between the first plate and the second plate for diffusion bonding the first plate to the second plate, and wherein an aluminum-silicon foil interlayer is disposed between the second plate and the third plate for diffusion bonding the second plate to the third plate.
    Type: Application
    Filed: July 8, 2021
    Publication date: March 24, 2022
    Inventors: Joseph Frederick BEHNKE, Reyn Tetsuro WAKABAYASHI, Carlaton WONG, Timothy Joseph FRANKLIN, Joseph F. SOMMERS
  • Publication number: 20220093361
    Abstract: Embodiments of showerheads are provided herein. In some embodiments, a showerhead assembly includes a chill plate having a plurality of recursive gas paths and one or more cooling channels disposed therein, wherein each of the plurality of recursive gas paths is fluidly coupled to a single gas inlet extending to a first side of the chill plate and a plurality of gas outlets extending to a second side of the chill plate; and a heater plate coupled to the chill plate, wherein the heater plate includes a plurality of first gas distribution holes extending from a top surface thereof to a plurality of plenums disposed within the heater plate, the plurality of first gas distribution holes corresponding with the plurality of gas outlets of the chill plate, and a plurality of second gas distribution holes extending from the plurality of plenums to a lower surface of the heater plate.
    Type: Application
    Filed: September 22, 2020
    Publication date: March 24, 2022
    Inventors: Reyn Tetsuro WAKABAYASHI, Carlaton WONG, Timothy Joseph FRANKLIN
  • Publication number: 20210331183
    Abstract: Embodiments of showerhead assemblies and fasteners for use in coupling components of showerhead assemblies are provided herein. More particularly, the fasteners described herein can advantageously be used to connect a gas distribution plate to a backing plate of the showerhead assembly. The fasteners described herein can further advantageously be used to robustly connect components together where the components have different coefficients of thermal expansion.
    Type: Application
    Filed: April 26, 2021
    Publication date: October 28, 2021
    Inventors: Carlaton WONG, Reyn Tetsuro WAKABAYASHI
  • Publication number: 20210287881
    Abstract: An apparatus for processing substrates that includes a process chamber with a process volume located above a substrate support assembly surrounded by an edge ring, an upper electrode located above the process volume and a conductive tuning ring surrounding the upper electrode and in electrical contact with the upper electrode. The conductive tuning ring has at least one gas port on a lower surface above the edge ring. The conductive tuning may also have at least one stepped portion on the lower surface that forms an extended bottom surface. In some embodiments, the extended bottom surface may slant radially inwardly or radially outwardly. In some embodiments, the extended bottom surface may have one or more radiused edges.
    Type: Application
    Filed: January 25, 2021
    Publication date: September 16, 2021
    Inventors: Timothy Joseph FRANKLIN, Carlaton WONG, Reyn Tetsuro WAKABAYASHI, Daniel Sang BYUN, Steven BABAYAN
  • Publication number: 20200411355
    Abstract: Embodiments of a plug for use in an electrostatic chuck are provided herein. In some embodiments, a plug for use in an electrostatic chuck includes a polymer sleeve having a central opening; a core press-fit in the central opening of the polymer sleeve and having a gas flow channel disposed therethrough; a cap disposed on the polymer sleeve and covering the core, the cap having a through hole through the cap; and an annular channel disposed between the core and the cap, wherein the core, the cap, and the annular channel define a gas flow path through the plug.
    Type: Application
    Filed: June 12, 2020
    Publication date: December 31, 2020
    Inventors: Hamid NOORBAKHSH, Anwar HUSAIN, Kartik RAMASWAMY, Sergio Fukuda SHOJI, Reyn Tetsuro WAKABAYASHI