Patents by Inventor Reynaldo C. Javier

Reynaldo C. Javier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110248392
    Abstract: A ball grid array device (100) based on a metallic leadframe (110) that has the footprint of a BGA package with terminals (112) in a full two-dimensional array, and combines the structure of a leadframe with the function of a substrate. At least one terminal (112a) is at the center of the device bottom. The terminals and leads (111) are made of metal having a greater thickness at the terminals than at the leads. The terminals may have a solderable surface. A semiconductor chip (120) is attached to the leadframe surface opposite the terminals, extending across adjacent leads.
    Type: Application
    Filed: October 12, 2010
    Publication date: October 13, 2011
    Applicant: Texas Instruments Incorporated
    Inventors: Reynaldo C. Javier, Sreenivasan K. Koduri
  • Publication number: 20070296056
    Abstract: An electronic device has a semiconductor chip (101) with a surface and an electric circuit including terminals on the surface. The circuit has a first (103) and a second terminal (104) with a metallurgical composition for wire bonding. The chip has a conductive wire (120) above the chip surface, which has a length and a first and a second end; the first end is attached to the first terminal and the second end to the second terminal. The wire is shaped to form at least one sequence of a concave and a convex portion. The sequence may be configured to form a loop, or multiple wire loops resulting in a spiraling wire coil. The number, shape, and spatial sequence of the loops control the electrical inductance of the wire; the inductance is selected to fine-tune the high frequency characteristics of the circuit.
    Type: Application
    Filed: June 27, 2006
    Publication date: December 27, 2007
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Anthony L. Coyle, Reynaldo C. Javier, Jeffrey G. Holloway
  • Publication number: 20020056347
    Abstract: A method for cutting integrated circuit packages includes providing an integrated circuit package, and cutting the integrated circuit package with a water jet.
    Type: Application
    Filed: October 11, 2001
    Publication date: May 16, 2002
    Inventors: Ferdinand S. Signey, Shirley L. Signey, Reynaldo C. Javier, Mary J. Javier