Patents by Inventor Reynaldo Malandac Maniacup

Reynaldo Malandac Maniacup has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11133199
    Abstract: A semiconductor package is provided which addresses problems of mold cap heel cracking. The package may made by using a cavity die and a gate insertion tool. The gate insertion tool, which fits into the cavity die, has an elongated body and includes a nozzle head with an edge which is contoured in relation to a mold cap formed on a substrate. The edge defines a curved border, for the mold cap, from a plane above the substrate to a plane lying on the substrate. The nozzle head includes a slot, for admitting a cull runner tip, centered on an axis of the elongated body.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: September 28, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Manengway Bumal-o Bangaan, Rosil Pascual Siloy, Arvin Abellera Dela Cruz, Reynaldo Malandac Maniacup
  • Publication number: 20210050228
    Abstract: A semiconductor package is provided which addresses problems of mold cap heel cracking. The package may made by using a cavity die and a gate insertion tool. The gate insertion tool, which fits into the cavity die, has an elongated body and includes a nozzle head with an edge which is contoured in relation to a mold cap formed on a substrate. The edge defines a curved border, for the mold cap, from a plane above the substrate to a plane lying on the substrate. The nozzle head includes a slot, for admitting a cull runner tip, centered on an axis of the elongated body.
    Type: Application
    Filed: August 14, 2019
    Publication date: February 18, 2021
    Inventors: Manengway Bumal-o Bangaan, Rosil Pascual Siloy, Arvin Abellera Dela Cruz, Reynaldo Malandac Maniacup