Patents by Inventor Reynaldo Vincent H. Sta Agueda

Reynaldo Vincent H. Sta Agueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Camera module in a unibody circuit carrier with component embedding
    Patent number: 10090358
    Abstract: A camera module assembly including a circuit carrier substrate having a first region integrally formed with a second region, the second region being movable with respect to the first region. The camera module assembly may further include an image sensor device positioned within a cavity formed in the first region of the circuit carrier substrate. The image sensor device may have a conductive via and a redistribution layer formed therein. The conductive via and the redistribution layer are electrically connected to the circuit carrier substrate along the side of the image sensor device facing the circuit carrier substrate. The camera module assembly further includes an electronic component positioned within a second cavity formed in the first region, the electronic component being electrically connected to the circuit carrier substrate.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: October 2, 2018
    Assignee: Apple Inc.
    Inventors: Annabelle Q. Yang, Steven Webster, Reynaldo Vincent H. Sta Agueda, Christopher Hunat
  • CAMERA MODULE IN A UNIBODY CIRCUIT CARRIER WITH COMPONENT EMBEDDING
    Publication number: 20170048472
    Abstract: A camera module assembly including a circuit carrier substrate having a first region integrally formed with a second region, the second region being movable with respect to the first region. The camera module assembly may further include an image sensor device positioned within a cavity formed in the first region of the circuit carrier substrate. The image sensor device may have a conductive via and a redistribution layer formed therein. The conductive via and the redistribution layer are electrically connected to the circuit carrier substrate along the side of the image sensor device facing the circuit carrier substrate. The camera module assembly further includes an electronic component positioned within a second cavity formed in the first region, the electronic component being electrically connected to the circuit carrier substrate.
    Type: Application
    Filed: August 11, 2016
    Publication date: February 16, 2017
    Inventors: Annabelle Q. Yang, Steven Webster, Reynaldo Vincent H. Sta Agueda, Christopher Hunat