Abstract: A system for testing integrated circuits is described. A contactor board of the system has pins with ends that contact terminals on a power and signal distribution board. Opposing ends of the pins make contact with die terminals on an unsingulated wafer. The distribution board also carries a plurality of capacitors, at least one capacitor corresponding to every die on the unsingulated wafer. Each capacitor may include two substantially flat planar capacitor conductors and a dielectric layer between the capacitor conductors. Alternatively, the capacitors may be discrete components mounted to and standing above the distribution board, in which case corresponding capacitor openings are formed in the contactor substrate to accommodate the capacitors when the distribution board and the contactor board are brought together. A plurality of fuses made of a polymer material are also provided.

Abstract: A reusable carrier 10 for temporarily holding an integrated circuit 12 during burn-in and electrical test includes a base 14 and a lid 16 attached to the base 14 by hinges 18. A flexible substrate 19 is attached to the base 14. Alignment posts 20 have tapered surfaces 22 that engage corners 24 of the integrated circuit 12 to position the integrated circuit 12 precisely on upper surface 26 of the substrate 19. A spring-loaded latch 28 engages projection 30 in aperture 32 of the base 14 to hold the lid 16 closed over the integrated circuit 12. Electrically conductive traces 34 on the surface 26 have contact bumps which engage contact pads on the underside of the integrated circuit 12 to connect the integrated circuit 12 to peripheral contact pads 38 around edges 40 of the substrate 19.

Abstract: A reusable carrier (10) for temporarily holding an integrated circuit (12) during burn-in and electrical test includes a base (14) and a lid (16) attached to the base (14) by hinges (18). A flexible substrate (19) is attached to the base (14) with a suitable adhesive. Alignment posts (20) have tapered surfaces (22) that engage corners (24) of the integrated circuit (12) to position the integrated circuit (12) precisely on upper surface (26) of the substrate (19). A spring-loaded latch (28) engages projection (30) in aperture (32) of the base (14) to hold the lid (16) closed over the integrated circuit (12). Electrically conductive traces (34) on the surface (26) have contact bumps which engage contact pads on the underside of the circuit (12) to connect the integrated circuit (12) to peripheral contact pads (38) around edges (40) of the substrate (19).