Patents by Inventor Rhonda Jean Heytens

Rhonda Jean Heytens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7574793
    Abstract: A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions formed by a plurality of first ceramic layers and at least one second ceramic layer, respectively, that are superimposed and bonded to each other. Conductor lines are present on at least some of the first ceramic layers so as to be between adjacent pairs of the layers. Electrically-conductive vias electrically interconnect the conductor lines on different first ceramic layers, and a surface-mount IC device is mounted to the substrate. The first ceramic layers are formed of electrically-nonconductive materials, while the one or more second ceramic layers contain thermally-conductive particles dispersed in a matrix of electrically-nonconductive materials, such that the one or more second ceramic layers are more thermally conductive than the first ceramic layers.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: August 18, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Dwadasi Hare Rama Sarma, Rhonda Jean Heytens, Carl William Berlin, Manuel Ray Fairchild, Bruce Alan Myers, Daniel Keith Ward
  • Patent number: 7321098
    Abstract: A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions formed by a plurality of first ceramic layers and at least one second ceramic layer, respectively, that are superimposed and bonded to each other. Conductor lines are present on at least some of the first ceramic layers so as to be between adjacent pairs of the layers. Electrically-conductive vias electrically interconnect the conductor lines on different first ceramic layers, and a surface-mount IC device is mounted to the substrate. The first ceramic layers are formed of electrically-nonconductive materials, while the one or more second ceramic layers contain thermally-conductive particles dispersed in a matrix of electrically-non-conductive materials, such that the one or more second ceramic layers are more thermally conductive than the first ceramic layers.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: January 22, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Dwadasi Hare Rama Sarma, Rhonda Jean Heytens, Carl William Berlin, Manuel Ray Fairchild, Bruce Alan Myers, Daniel Keith Ward