Patents by Inventor Ri Li
Ri Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11723116Abstract: An electronic device is provided. The electronic device includes a RFIC to convert data transmitted from the a communication processor into a RF signal and output the RF signal, and an antenna configured to receive the RF signal and radiate an electromagnetic field, the communication processor is configured to receive, from a BS, a reference signal for identifying a state of a downlink channel between the electronic device and the BS through the antenna and the RFIC, based on the reference signal and association information between the downlink channel and an uplink channel and between the electronic device and the BS, identify the uplink channel, based on the identified uplink channel, identify a precoder for the uplink channel, based on the identified precoder, precode uplink data and a DMRS, and transmit a signal based on the precoded data to the BS using at least some of the RFIC and the antenna.Type: GrantFiled: April 2, 2020Date of Patent: August 8, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Yonggue Han, He Wang, Taeyoon Kim, Chaiman Lim, Liang Yan, Ri Li
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Publication number: 20200413488Abstract: An electronic device is provided. The electronic device includes a RFIC to convert data transmitted from the a communication processor into a RF signal and output the RF signal, and an antenna configured to receive the RF signal and radiate an electromagnetic field, the communication processor is configured to receive, from a BS, a reference signal for identifying a state of a downlink channel between the electronic device and the BS through the antenna and the RFIC, based on the reference signal and association information between the downlink channel and an uplink channel and between the electronic device and the BS, identify the uplink channel, based on the identified uplink channel, identify a precoder for the uplink channel, based on the identified precoder, precode uplink data and a DMRS, and transmit a signal based on the precoded data to the BS using at least some of the RFIC and the antenna.Type: ApplicationFiled: April 2, 2020Publication date: December 31, 2020Inventors: Yonggue HAN, He WANG, Taeyoon KIM, Chaiman LIM, Liang YAN, Ri LI
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Patent number: 9854704Abstract: A heat sink with shape-optimized fins provides for improved heat transfer. Synthetic jets create vortices which enhance heat transfer and cooling of downstream fins, while the shape of the fins limits pressure drop in the flow over the cooling fins.Type: GrantFiled: July 10, 2014Date of Patent: December 26, 2017Assignee: General Electric CompanyInventors: Pradeep Chandra Babu Salapakkam, Ri Li, Mehmet Arik, William Dwight Gerstler, Bryan Patrick Whalen
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Patent number: 9615482Abstract: A heat sink with shape-optimized fins provides for improved heat transfer. Synthetic jets create vortices which enhance heat transfer and cooling of downstream fins, while the shape of the fins limits pressure drop in the flow over the cooling fins.Type: GrantFiled: December 10, 2010Date of Patent: April 4, 2017Assignee: General Electric CompanyInventors: Pradeep Chandra Babu Salapakkam, Ri Li, Mehmet Arik, William Dwight Gerstler, Bryan Patrick Whalen
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Patent number: 9572280Abstract: A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.Type: GrantFiled: August 1, 2014Date of Patent: February 14, 2017Assignee: General Electric CompanyInventors: Mehmet Arik, William Dwight Gerstler, Ri Li, Earl Ross Nicewarner, Christina Clyde Schroeder, Benjamin Jon Vander Ploeg, Bryan Patrick Whalen
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Publication number: 20170040242Abstract: A thermal management system is provided. The thermal management system includes at least one heat sink including one or more respective fins, wherein the one or more fins include one or more respective cavities. The thermal management system also includes a synthetic jet stack including at least one synthetic jet mounted within each of the respective cavities employing at least one engaging structure to provide a rigid positioning of the synthetic jet stack within the fins, wherein the synthetic jet includes at least one orifice through which a fluid is ejected.Type: ApplicationFiled: October 20, 2016Publication date: February 9, 2017Inventors: Mehmet Arik, William Dwight Gerstler, Ri Li, Pradeep Chandra Babu Salapakkam, Bryan Patrick Whalen
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Patent number: 9478479Abstract: A thermal management system is provided. The thermal management system includes at least one heat sink including one or more respective fins, wherein the one or more fins include one or more respective cavities. The thermal management system also includes a synthetic jet stack including at least one synthetic jet mounted within each of the respective cavities employing at least one engaging structure to provide a rigid positioning of the synthetic jet stack within the fins, wherein the synthetic jet includes at least one orifice through which a fluid is ejected.Type: GrantFiled: October 26, 2010Date of Patent: October 25, 2016Assignee: General Electric CompanyInventors: Mehmet Arik, William Dwight Gerstler, Ri Li, Pradeep Chandra Babu Salapakkam, Bryan Patrick Whalen
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Patent number: 9474184Abstract: A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.Type: GrantFiled: August 1, 2014Date of Patent: October 18, 2016Assignee: General Electric CompanyInventors: Mehmet Arik, William Dwight Gerstler, Ri Li, Earl Ross Nicewarner, Christina Clyde Schroeder, Benjamin Jon Vander Ploeg, Bryan Patrick Whalen
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Patent number: 9474183Abstract: A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.Type: GrantFiled: July 10, 2014Date of Patent: October 18, 2016Assignee: General Electric CompanyInventors: Mehmet Arik, William Dwight Gerstler, Ri Li, Earl Ross Nicewarner, Christina Clyde Schroeder, Benjamin Jon Vander Ploeg, Bryan Patrick Whalen
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Publication number: 20140338861Abstract: A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.Type: ApplicationFiled: August 1, 2014Publication date: November 20, 2014Inventors: Mehmet Arik, William Dwight Gerstler, Ri Li, Earl Ross Nicewarner, Christina Clyde Schroeder, Benjamin Jon Vander Ploeg, Bryan Patrick Whalen
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Publication number: 20140338862Abstract: A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.Type: ApplicationFiled: August 1, 2014Publication date: November 20, 2014Inventors: Mehmet Arik, William Dwight Gerstler, Ri Li, Earl Ross Nicewarner, Christina Clyde Schroeder, Benjamin Jon Vander Ploeg, Bryan Patrick Whalen
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Publication number: 20140318755Abstract: A heat sink with shape-optimized fins provides for improved heat transfer. Synthetic jets create vortices which enhance heat transfer and cooling of downstream fins, while the shape of the fins limits pressure drop in the flow over the cooling fins.Type: ApplicationFiled: July 10, 2014Publication date: October 30, 2014Inventors: Pradeep Chandra Babu Salapakkam, Ri Li, Mehmet Arik, William Dwight Gerstler, Bryan Patrick Whalen
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Publication number: 20140318740Abstract: A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.Type: ApplicationFiled: July 10, 2014Publication date: October 30, 2014Inventors: Mehmet Arik, William Dwight Gerstler, Ri Li, Earl Ross Nicewarner, Christina Clyde Schroeder, Benjamin Jon Vander Ploeg, Bryan Patrick Whalen
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Patent number: 8776871Abstract: A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.Type: GrantFiled: April 14, 2010Date of Patent: July 15, 2014Assignee: General Electric CompanyInventors: Mehmet Arik, William Dwight Gerstler, Ri Li, Earl Ross Nicewarner, Christina Clyde Schroeder, Benjamin Jon Vander Ploeg, Bryan Patrick Whalen
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Patent number: 8529097Abstract: Lighting systems having a light source and a thermal management system are provided. The thermal management system includes synthetic jet devices, a heat sink and a heat distribution face plate. The synthetic jet devices are arranged in parallel to one and other and are configured to actively cool the lighting system. The heat distribution face plate is configured to radially transfer heat from the light source into the ambient air.Type: GrantFiled: October 21, 2010Date of Patent: September 10, 2013Assignee: General Electric CompanyInventors: Mehmet Arik, Stanton Earl Weaver, Thomas Elliot Stecher, Glenn Howard Kuenzler, Charles Franklin Wolfe, Jr., Ri Li
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Publication number: 20120098425Abstract: Lighting systems having a light source and a thermal management system are provided. The thermal management system includes synthetic jet devices, a heat sink and a heat distribution face plate. The synthetic jet devices are arranged in parallel to one and other and are configured to actively cool the lighting system. The heat distribution face plate is configured to radially transfer heat from the light source into the ambient air.Type: ApplicationFiled: October 21, 2010Publication date: April 26, 2012Applicant: General Electric CompanyInventors: Mehmet Arik, Stanton Earl Weaver, Thomas Elliot Stecher, Glenn Howard Kuenzler, Charles Franklin Wolfe, JR., Ri Li
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Publication number: 20120097377Abstract: A thermal management system is provided. The thermal management system includes at least one heat sink including one or more respective fins, wherein the one or more fins include one or more respective cavities. The thermal management system also includes a synthetic jet stack including at least one synthetic jet mounted within each of the respective cavities employing at least one engaging structure to provide a rigid positioning of the synthetic jet stack within the fins, wherein the synthetic jet includes at least one orifice through which a fluid is ejected.Type: ApplicationFiled: October 26, 2010Publication date: April 26, 2012Applicant: GENERAL ELECTRIC COMPANYInventors: Mehmet Arik, William Dwight Gerstler, Ri Li, Pradeep Chandra Babu Salapakkam, Bryan Patrick Whalen
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Publication number: 20110139429Abstract: A heat sink with shape-optimized fins provides for improved heat transfer. Synthetic jets create vortices which enhance heat transfer and cooling of downstream fins, while the shape of the fins limits pressure drop in the flow over the cooling fins.Type: ApplicationFiled: December 10, 2010Publication date: June 16, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Pradeep Chandra Babu Salapakkam, Ri Li, Mehmet Arik, William Dwight Gerstler, Bryan Patrick Whalen
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Publication number: 20110114287Abstract: A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.Type: ApplicationFiled: April 14, 2010Publication date: May 19, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Mehmet Arik, William Dwight Gerstler, Ri Li, Earl Ross Nicewarner, Christina Clyde Schroeder, Benjamin Jon Vander Ploeg, Bryan Patrick Whalen