Abstract: A flexible organic X-ray detector, an imaging system including the flexible organic detector and methods for fabricating a flexible organic X-ray detector having a layered structure are presented. The detector includes a flexible substrate and a thin glass substrate operatively coupled to the flexible substrate. Further, the detector includes a thin film transistor array disposed on the thin glass substrate. Additionally, the detector includes an organic photodiode including one or more layers disposed on the thin film transistor array. Moreover, the detector includes a scintillator layer disposed on the organic photodiode.

Abstract: Imaging panels and imaging systems that may employ use organic photodiodes or other continuous sensors are discussed. The detector panels discussed may have a non-pixelated organic photodiode disposed above a pixelated backplane. In some embodiments, the sensor panels may also include dielectric structures that create buried vias in the region of contact between the organic photodiode and the thin film transistor (TFT) backplane. In some embodiments, the sensor panels may include dielectric structures that separate neighboring pixels. The dielectric structures may decrease thickness inhomogeneity in active areas of the organic photodiode. Detector panels discussed herein may have decreased sensing lag and current leakage, and improved reliability. Methods for formation of organic photodiodes and of dielectric structures are also discussed.

Abstract: Imaging panels and imaging systems that may employ use organic photodiodes or other continuous sensors are discussed. The detector panels discussed may have a non-pixelated organic photodiode disposed above a pixelated backplane. In some embodiments, the sensor panels may also include dielectric structures that create buried vias in the region of contact between the organic photodiode and the thin film transistor (TFT) backplane. In some embodiments, the sensor panels may include dielectric structures that separate neighboring pixels. The dielectric structures may decrease thickness inhomogeneity in active areas of the organic photodiode. Detector panels discussed herein may have decreased sensing lag and current leakage, and improved reliability. Methods for formation of organic photodiodes and of dielectric structures are also discussed.

Abstract: A process for fabricating an organic x-ray detector is presented. The process includes forming a layered structure that includes disposing a first electrode layer on a thin film transistor array, disposing an organic photoactive layer on the first electrode layer and disposing a second electrode layer on the organic photoactive layer. The organic photoactive layer includes a fullerene or a fullerene derivative having a carbon cluster of at least 70 carbon atoms. The process further includes disposing a scintillator layer on the layered structure at a temperature greater than 50 degrees Celsius. An organic x-ray detector fabricated by the process is further presented. An x-ray system including the organic x-ray detector is also presented.

Abstract: An organic x-ray detector and a method of making the organic x-ray detector are disclosed. The x-ray detector includes a TFT array disposed on a substrate, an organic photodiode layer disposed on the TFT array, a barrier layer disposed on the photodiode layer, and a scintillator layer disposed on the barrier layer, such that the barrier layer includes at least one inorganic material.

Abstract: An organic charge integrating device is presented. The organic charge integrating device includes a thin film transistor (TFT) array, a first electrode layer disposed on the TFT array, an organic photoactive layer disposed on the first electrode layer, and a second electrode layer disposed on the organic photoactive layer. The organic photoactive layer has a thickness in a range from about 700 nanometers to about 3 microns. An organic x-ray detector is presented. An imaging system including the organic x-ray detector is also presented.

Abstract: A process for fabricating an organic photodetector is presented. The process includes providing an array of thin film transistor assemblies, each thin film transistor assembly including a first electrode disposed on a thin film transistor; disposing an organic semiconductor layer on the array; disposing a second electrode layer including a first inorganic material on the organic semiconductor layer through a shadow mask to form a first etch stop layer; and removing portions of the organic semiconductor layer unprotected by the first etch stop layer using a dry etching process to form a multilayered structure. An organic photodetector, for example an organic x-ray detector fabricated by the process is further presented. An x-ray system including the organic x-ray detector is also presented.

Abstract: A process for fabricating an organic x-ray detector is presented. The process includes forming a layered structure that includes disposing a first electrode layer on a thin film transistor array, disposing an organic photoactive layer on the first electrode layer and disposing a second electrode layer on the organic photoactive layer. The organic photoactive layer includes a fullerene or a fullerene derivative having a carbon cluster of at least 70 carbon atoms. The process further includes disposing a scintillator layer on the layered structure at a temperature greater than 50 degrees Celsius. An organic x-ray detector fabricated by the process is further presented. An x-ray system including the organic x-ray detector is also presented.

Abstract: A process for forming a capacitor is presented. The process includes providing a laminate including a dielectric layer disposed on a sacrificial substrate, forming a free-standing metallized dielectric layer and packaging the free-standing metallized dielectric layer to form a capacitor. The dielectric layer includes a polyetherimide. The step of forming the free-standing metallized dielectric layer is performed by: (a) disposing a metal layer on the dielectric layer to form a metalized laminate such that a metalized dielectric layer is formed on the sacrificial substrate, and removing the sacrificial substrate to form the free-standing metallized dielectric layer; or (b) removing the sacrificial substrate from the laminate to form a free-standing dielectric layer, and disposing a metal layer on the free-standing dielectric layer to form the free-standing metallized dielectric layer. A capacitor formed by the process is presented.

Abstract: A high-temperature insulation assembly for use in high-temperature electrical machines and a method for forming a high-temperature insulation assembly for insulating conducting material in a high-temperature electrical machine. The assembly includes a polymeric film and at least one ceramic coating disposed on the polymeric film. The polymeric film is disposed over conductive wiring or used as a conductor winding insulator for phase separation and slot liner.

Abstract: Optoelectronic devices with enhanced internal outcoupling include a substrate, an anode, a cathode, an electroluminescent layer, and an electron transporting layer comprising inorganic nanoparticles dispersed in an organic matrix.

Abstract: The present disclosure relates to a technical field of display, and discloses a backlight module fitting platform. The backlight module fitting platform includes a primary platform and a number of first supporting pads located at a surface of the primary platform for supporting the backlight module. The backlight module fitting module further includes a lifting mechanism connected to the first supporting pad and supporting each of the first supporting pads to rise and fall independently. According to the backlight module fitting platform of the present disclosure, independent rise and fall of each of the first supporting pads is adjusted via the lifting mechanism so that the backlight module fitting platform is adapted for fitting of even-back and uneven-back backlight modules and can stably support and fit the backlight modules.

Abstract: A flexible organic X-ray detector, an imaging system including the flexible organic detector and methods for fabricating a flexible organic X-ray detector having a layered structure are presented. The detector includes a flexible substrate and a thin glass substrate operatively coupled to the flexible substrate. Further, the detector includes a thin film transistor array disposed on the thin glass substrate. Additionally, the detector includes an organic photodiode including one or more layers disposed on the thin film transistor array. Moreover, the detector includes a scintillator layer disposed on the organic photodiode.

Abstract: A surface-mount package structure for reducing the ingress of moisture and gases thereto is disclosed. The surface-mount structure includes a sub-module having a dielectric layer, semiconductor devices attached to the dielectric layer, a first level interconnect structure electrically coupled to the semiconductor devices, and a second level I/O connection electrically coupled to the first level interconnect and formed on the dielectric layer, with the second level I/O connection configured to connect the sub-module to an external circuit. The semiconductor devices of the sub-module are attached to a substrate structure, with a dielectric material positioned between the dielectric layer and the substrate structure to fill in gaps in the surface-mount structure.

Abstract: A radiation detector assembly including an organic photodetector that generate charge in response to an incident radiation, a thin film transistor array including a plurality of pixels. The plurality of pixels may produce electric signals corresponding to the charge generated by the organic photodetector. The radiation detector assembly also includes a spacer disposed on the thin film transistor array. The spacer surrounds one or more pixels and may confine the organic photodetector within the surrounded one or more pixels such that the surrounded one or more pixels are electrically isolated from a neighboring pixel.

Abstract: The present disclosure relates to a technical field of display, and discloses a backlight module fitting platform. The backlight module fitting platform includes a primary platform and a number of first supporting pads located at a surface of the primary platform for supporting the backlight module. The backlight module fitting module further includes a lifting mechanism connected to the first supporting pad and supporting each of the first supporting pads to rise and fall independently. According to the backlight module fitting platform of the present disclosure, independent rise and fall of each of the first supporting pads is adjusted via the lifting mechanism so that the backlight module fitting platform is adapted for fitting of even-back and uneven-back backlight modules and can stably support and fit the backlight modules.

Abstract: A radiation detector assembly including an organic photodetector that generate charge in response to an incident radiation, a thin film transistor array including a plurality of pixels. The plurality of pixels may produce electric signals corresponding to the charge generated by the organic photodetector. The radiation detector assembly also includes a spacer disposed on the thin film transistor array. The spacer surrounds one or more pixels and may confine the organic photodetector within the surrounded one or more pixels such that the surrounded one or more pixels are electrically isolated from a neighboring pixel.

Abstract: An organic x-ray detector and a method of making the organic x-ray detector are disclosed. The x-ray detector includes a TFT array disposed on a substrate, an organic photodiode layer disposed on the TFT array, a barrier layer disposed on the photodiode layer, and a scintillator layer disposed on the barrier layer, such that the barrier layer includes at least one inorganic material.

Abstract: Optoelectronic devices that have enhanced internal outcoupling are disclosed. The devices include a substrate, an anode, a cathode, an electroluminescent layer, and a hole injecting layer. The hole injecting layer includes inorganic nanoparticles that have a bimodal particle size distribution and which are dispersed in an organic matrix.

Abstract: A high-temperature insulation assembly for use in high-temperature electrical machines and a method for forming a high-temperature insulation assembly for insulating conducting material in a high-temperature electrical machine. The assembly includes a polymeric film and at least one ceramic coating disposed on the polymeric film. The polymeric film is disposed over conductive wiring or used as a conductor winding insulator for phase separation and slot liner.