Patents by Inventor Éric Mateu-Huon

Éric Mateu-Huon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9913407
    Abstract: The vertical data center module is a multistory compact footprint data center unit that exploits vertical air movements, both downward and upward, to efficiently sustain conventional low-cost air-cooled computing systems. It integrates a hybrid cooling system that can benefit from an air-side economizer without compromising its compact footprint. For polluted urban environments, this air-side economizer comprises an air-to-air heat exchanger to effectively limit the amount of outside air that can enter the module and come into contact with sensitive computing systems. Through side-to-side, side-to-back or back-to-back juxtaposition, multiple units can be assembled in clusters on a colocation site to create large-scale vertical data center complexes, effectively maximizing real estate use and cost effectiveness by fully exploiting all three dimensions.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: March 6, 2018
    Assignee: VERT.COM INC.
    Inventors: Marc Parizeau, Eric Mateu-Huon, Philippe Savard
  • Patent number: 9907212
    Abstract: A system for building multistory data centers using prefabricated modules that can be both juxtaposed side-by-side and stacked vertically, with fluid communication across stories to create two-way vertical airflow for efficient and cost effective high density heat management.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: February 27, 2018
    Assignee: VERT.COM INC
    Inventors: Marc Parizeau, Eric Mateu-Huon
  • Publication number: 20170042067
    Abstract: The vertical data center module is a multistory compact footprint data center unit that exploits vertical air movements, both downward and upward, to efficiently sustain conventional low-cost air-cooled computing systems. It integrates a hybrid cooling system that can benefit from an air-side economizer without compromising its compact footprint. For polluted urban environments, this air-side economizer comprises an air-to-air heat exchanger to effectively limit the amount of outside air that can enter the module and come into contact with sensitive computing systems. Through side-to-side, side-to-back or back-to-back juxtaposition, multiple units can be assembled in clusters on a colocation site to create large-scale vertical data center complexes, effectively maximizing real estate use and cost effectiveness by fully exploiting all three dimensions.
    Type: Application
    Filed: April 28, 2015
    Publication date: February 9, 2017
    Inventors: Marc PARIZEAU, Eric MATEU-HUON, Philippe SAVARD
  • Publication number: 20160249484
    Abstract: A system for building multistory data centers using prefabricated modules that can be both juxtaposed side-by-side and stacked vertically, with fluid communication across stories to create two-way vertical airflow for efficient and cost effective high density heat management.
    Type: Application
    Filed: February 17, 2016
    Publication date: August 25, 2016
    Inventors: Marc PARIZEAU, Eric MATEU-HUON
  • Publication number: 20160076265
    Abstract: A data center module is a data center that can be prefabricated using generally standardized off-the-shelf components, and quickly assembled on a collocation site where a shared central facility is provided. The data center module is typically configured to be deployed with other identical data center modules around the central facility both in side-to-side and/or in back-to-back juxtapositions, typically without the need for interleaving space between adjacent modules in order to maximize real estate use. Each data center module typically comprises harden party walls, several floors for accommodating all the necessary electrical and cooling subsystems and for accommodating all the computing machinery (e.g. servers). Though all the data center modules share similar physical configuration, each data center module can be independently customized and operated to accommodate different needs.
    Type: Application
    Filed: November 27, 2015
    Publication date: March 17, 2016
    Inventors: Marc PARIZEAU, Eric MATEU-HUON, Philippe SAVARD
  • Patent number: 9228366
    Abstract: A data center module is a data center that can be prefabricated using generally standardized off-the-shelf components, and quickly assembled on a collocation site where a shared central facility is provided. The data center module is typically configured to be deployed with other identical data center modules around the central facility both in side-to-side and/or in back-to-back juxtapositions, typically without the need for interleaving space between adjacent modules in order to maximize real estate use. Each data center module typically comprises harden party walls, several floors for accommodating all the necessary electrical and cooling subsystems and for accommodating all the computing machinery (e.g. servers). Though all the data center modules share similar physical configuration, each data center module can be independently customized and operated to accommodate different needs.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: January 5, 2016
    Assignee: Vert. COM Inc.
    Inventors: Marc Parizeau, Eric Mateu-Huon, Philippe Savard
  • Publication number: 20150159389
    Abstract: A data center module is a data center that can be prefabricated using generally standardized off-the-shelf components, and quickly assembled on a collocation site where a shared central facility is provided. The data center module is typically configured to be deployed with other identical data center modules around the central facility both in side-to-side and/or in back-to-back juxtapositions, typically without the need for interleaving space between adjacent modules in order to maximize real estate use. Each data center module typically comprises harden party walls, several floors for accommodating all the necessary electrical and cooling subsystems and for accommodating all the computing machinery (e.g. servers). Though all the data center modules share similar physical configuration, each data center module can be independently customized and operated to accommodate different needs.
    Type: Application
    Filed: December 19, 2014
    Publication date: June 11, 2015
    Inventors: Marc Parizeau, Éric Mateu-Huon, Philippe Savard
  • Patent number: 8943757
    Abstract: A data center module is a data center that can be prefabricated using generally standardized off-the-shelf components, and quickly assembled on a collocation site where a shared central facility is provided. The data center module is typically configured to be deployed with other identical data center modules around the central facility both in side-to-side and/or in back-to-back juxtapositions, typically without the need for interleaving space between adjacent modules in order to maximize real estate use. Each data center module typically comprises harden party walls, several floors for accommodating all the necessary electrical and cooling subsystems and for accommodating all the computing machinery (e.g. servers). Though all the data center modules share similar physical configuration, each data center module can be independently customized and operated to accommodate different needs.
    Type: Grant
    Filed: January 21, 2013
    Date of Patent: February 3, 2015
    Assignee: Vert.com Inc.
    Inventors: Marc Parizeau, Éric Mateu-Huon, Philippe Savard
  • Publication number: 20140157692
    Abstract: A data center module is a data center that can be prefabricated using generally standardized off-the-shelf components, and quickly assembled on a collocation site where a shared central facility is provided. The data center module is typically configured to be deployed with other identical data center modules around the central facility both in side-to-side and/or in back-to-back juxtapositions, typically without the need for interleaving space between adjacent modules in order to maximize real estate use. Each data center module typically comprises harden party walls, several floors for accommodating all the necessary electrical and cooling subsystems and for accommodating all the computing machinery (e.g. servers). Though all the data center modules share similar physical configuration, each data center module can be independently customized and operated to accommodate different needs.
    Type: Application
    Filed: January 21, 2013
    Publication date: June 12, 2014
    Applicant: VERT.COM, INC.
    Inventors: Marc Parizeau, Éric Mateu-Huon, Philippe Savard