Abstract: Secure touchscreen devices are disclosed. In one embodiment, a secure touchscreen assembly may include a first patterned conductive layer comprising a first touch sensing grid and a first tamper sensing grid, the first tamper sensing grid disposed in areas of the first conductive layer where the first touch sensing grid is not present and is not in physical contact with the first touch sensing grid, and tamper sensing circuitry coupled to the first tamper sensing grid that detects a tamper by detecting change in conductivity in the first tamper sensing grid.

Abstract: Secure touchscreen devices are disclosed. In one embodiment, a secure touchscreen assembly may include a first patterned conductive layer comprising a first touch sensing grid and a first tamper sensing grid, the first tamper sensing grid disposed in areas of the first conductive layer where the first touch sensing grid is not present and is not in physical contact with the first touch sensing grid, and tamper sensing circuitry coupled to the first tamper sensing grid that detects a tamper by detecting change in conductivity in the first tamper sensing grid.

Abstract: One aspect of the present invention provides a server card that is removably insertable into a server chassis. An electronic power switching mechanism is disposed on the server card and is configured to cause three power states of the server card including a fully operational state, a standby state, and a fully shutdown state. In the fully operational state, a system power of the server card is enabled and a standby power of the server card is enabled. In the standby state, a system power of the server card is disabled and the standby power of the server card is enabled. In a shutdown state, the system power of the server card is disabled and the standby power of the server card is disabled.

Abstract: One embodiment disclosed relates to an apparatus for supplying redundant power to a plurality of computer systems. The apparatus includes at least one bus bar, a plurality of power supplies each supplying power at a same voltage level, a plurality of power switches, and a power supply management controller. Power inputs of the computer systems are connected to the at least one bus bar. The power supplies are selectively connected to the at least one bus bar using the power switches. The power supply management controller controls the power switches such that the power is supplied redundantly to the computer systems.

Abstract: A rack equipment power pricing plan control system and method is presented. In one embodiment of the present invention, a power pricing plan rack equipment control method is utilized to control operation of rack equipment. A power pricing plan for operating the rack equipment is established. The rack equipment is operated in accordance with the power pricing plan.

Abstract: A power distribution system comprises a flexible power connector, a printed circuit board, a power supply, and a processor mounted on the printed circuit board. The flexible power connector comprises a first end electrically connected to the processor and a second end electrically connected to the power supply. The flexible power connector is configured with a length so that the power supply is in a spaced relationship relative to the processor and the flexible power connector includes a plurality of stacked layers arranged generally parallel to each other for distributed power transmission. These layers include at least two ground layers and at least one power layer. The power layer is sandwiched between two of the at least two ground layers.

Abstract: A method and corresponding apparatus for mounting surface mount (SMT) components in a printed circuit board (PCB) add an aperture, i.e., an etched well, to the PCB to effectuate direct connection of high speed signals to the SMT components. The method eliminates the need of via and may be applied to any SMT components, such as inductors, resistors, capacitors, chips, and other components. In addition, since signal traces are shielded (not exposed to air), undesired side-effects, such as Electro-Magnetic Interference (EMI) and Cross Talk, and the like, may be reduced significantly. The method also ensures tighter signal impedance control and better propagation delay control. Additionally, faulty components may be replaced and/or repaired.