Patents by Inventor Ricardo Enrique Saad

Ricardo Enrique Saad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8251582
    Abstract: A communications device with integrated case temperature measurement includes a case having at least one thermally conductive wall and a circuit board at least partially disposed within the case. At least one electronic component is mounted on the circuit board and a temperature sensor is mounted on the circuit board. At least one thermally conductive protrusion extends from the wall and is thermally coupled to the temperature sensor.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: August 28, 2012
    Assignee: Finisar Corporation
    Inventors: Lucy G. Hosking, Ricardo Enrique Saad, Jingcheng Zhang, Jiashu Chen, Donald A. Ice
  • Publication number: 20120134387
    Abstract: A communications device with integrated case temperature measurement includes a case having at least one thermally conductive wall and a circuit board at least partially disposed within the case. At least one electronic component is mounted on the circuit board and a temperature sensor is mounted on the circuit board. At least one thermally conductive protrusion extends from the wall and is thermally coupled to the temperature sensor.
    Type: Application
    Filed: February 6, 2012
    Publication date: May 31, 2012
    Inventors: Lucy G. Hosking, Ricardo Enrique Saad, Jingcheng Zhang, Jiashu Chen, Donald A. Ice
  • Patent number: 8128283
    Abstract: The case temperature measurement device for an optoelectronic transceiver includes a case with at least one thermally conductive wall, at least one optical component at least partially disposed within the case, circuitry electrically coupled to the optical component. The circuitry includes a temperature sensor coupled to the circuitry. The case temperature measurement device also includes at least one protrusion formed on the wall of the case of the optoelectronic transceiver. The protrusion is thermally coupled to temperature sensor via a thermal pad. A method for estimating case temperature of the optoelectronic transceiver based on an internal temperature measurement and knowledge of the relationship between the measured internal temperature and the actual case temperature, and compensating for the effects of variable heat sources within the transceiver upon this estimate.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: March 6, 2012
    Assignee: Finisar Corporation
    Inventors: Lucy G. Hosking, Ricardo Enrique Saad, Jingcheng Zhang, Jiashu Chen, Donald A. Ice
  • Publication number: 20090097527
    Abstract: The case temperature measurement device for an optoelectronic transceiver includes a case with at least one thermally conductive wall, at least one optical component at least partially disposed within the case, circuitry electrically coupled to the optical component. The circuitry includes a temperature sensor coupled to the circuitry. The case temperature measurement device also includes at least one protrusion formed on the wall of the case of the optoelectronic transceiver. The protrusion is thermally coupled to temperature sensor via a thermal pad. A method for estimating case temperature of the optoelectronic transceiver based on an internal temperature measurement and knowledge of the relationship between the measured internal temperature and the actual case temperature, and compensating for the effects of variable heat sources within the transceiver upon this estimate.
    Type: Application
    Filed: September 29, 2008
    Publication date: April 16, 2009
    Inventors: Lucy G. Hosking, Ricardo Enrique Saad, Jingcheng Zhang, Jiashu Chen, Donald A. Ice