Abstract: Aspects of the subject technology provide miniaturization and improved power dissipation for communication systems that include a radio frequency power amplifier. In aspects, a radio frequency power amplifier may be mounted inside a cavity in a primary printed circuit board. Circuits related the power amplifier, such as output matching circuits, biasing circuits, and/or passive components, may be mounted on submodule printed circuit board that itself is mounted to the primary printed circuit board in a stacked configuration above the power amplifier and the cavity containing the power amplifier.