Patents by Inventor Ricardo Mariano

Ricardo Mariano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Recessed aperture-coupled patch antenna with multiple dielectrics for wireless applications
    Patent number: 6867738
    Abstract: The present invention provides an aperture-fed patch antenna assembly that is recessed into a conductive surface of an external shell of an electronic device. In one embodiment, an antenna feed attached to a removable core of the electronic device may be removed from the external shell without requiring a manual disconnecting of the antenna feed from a wireless radio modem in the electronic device. The patch antenna assembly includes a shim having an aperture therein and positioned between a primary dielectric and a printed circuit board to create a secondary dielectric between the primary dielectric and the printed circuit board. In one embodiment, the primary dielectric is ceramic and the shim is plastic.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: March 15, 2005
    Assignee: Apple Computer, Inc.
    Inventors: Thomas J. Birnbaum, Stephen C. Fenwick, Arthur W. Astrin, Ricardo Mariano
  • Recessed aperture-coupled patch antenna with multiple dielectrics for wireless applications
    Publication number: 20030117323
    Abstract: The present invention provides an aperture-fed patch antenna assembly that is recessed into a conductive surface of an external shell of an electronic device. In one embodiment, an antenna feed attached to a removable core of the electronic device may be removed from the external shell without requiring a manual disconnecting of the antenna feed from a wireless radio modem in the electronic device. The patch antenna assembly includes a shim having an aperture therein and positioned between a primary dielectric and a printed circuit board to create a secondary dielectric between the primary dielectric and the printed circuit board. In one embodiment, the primary dielectric is ceramic and the shim is plastic.
    Type: Application
    Filed: December 3, 2002
    Publication date: June 26, 2003
    Inventors: Thomas J. Birnbaum, Stephen C. Fenwick, Arthur W. Astrin, Ricardo Mariano