Abstract: Apparatus for the deposition of a material such as diamond on a substrate by chemical vapor deposition is provided. The apparatus comprises:support shelf on which the substrate is located;a resistance heating element in the form of an elongate strip of conductive material having at least one curved section in its length; the elongate strip being positioned relative to, and spaced from, the substrate such that it presents an elongate edge to the substrate and an elongate edge away from the substrate; andmeans such as a perforated pipe for causing reaction gas for the deposition to pass across the elongate strip from one longitudinal edge to the other and then to the support shelf and the substrate located thereon.

Abstract: The electronic component includes a mounting substrate having a surface provided with a plurality of spaced contact pads. A semiconductor chip is mounted on the substrate and includes at least one active element in the form of a photodiode on a substrate of light transmissive material. The active element has a metallized contact region and the semiconductor chip has a plurality of projecting metallized contact regions which are each electrically conductively bonded to a different one of the spaced contact pads of the mounting substrate. The photodiode may be a PIN diode and the semiconductor chips may be an integrated circuit to which the PIN diode is connected thereby providing an optical receiver equivalent to a PIN receiver.