Patents by Inventor Ricardo Villalaz

Ricardo Villalaz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication
    Patent number: 6788867
    Abstract: Optical interconnect layers and methods of fabrication thereof are described. In addition, the optical interconnect layers integrated into devices such as backplane (BP), printed wiring board (PWB), and multi-chip module (MCM) level devices are described. A representative optical interconnect layer includes a first cladding layer, a second cladding layer, one or more waveguides having a waveguide core and an air-gap cladding layer engaging a portion of waveguide core, wherein the first cladding layer and the second cladding layer engage the waveguide.
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: September 7, 2004
    Assignee: Georgia Tech Research Corp.
    Inventors: Tony Mule′, James D. Meindl, Paul Kohl, Stephen M. Schultz, Thomas K. Gaylord, Elias N. Glytsis, Ricardo Villalaz, Muhannad Bakir, Hollie Reed
  • Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication
    Publication number: 20040126076
    Abstract: Optical interconnect layers and methods of fabrication thereof are described. In addition, the optical interconnect layers integrated into devices such as backplane (BP), printed wiring board (PWB), and multi-chip module (MCM) level devices are described. A representative optical interconnect layer includes a first cladding layer, a second cladding layer, one or more waveguides having a waveguide core and an air-gap cladding layer engaging a portion of waveguide core, wherein the first cladding layer and the second cladding layer engage the waveguide.
    Type: Application
    Filed: December 11, 2003
    Publication date: July 1, 2004
    Inventors: Tony Mule, James D. Meindl, Paul Kohl, Stephen M. Schultz, Thomas K. Gaylord, Elias N. Glytsis, Ricardo Villalaz, Muhannad Bakir, Hollie Reed
  • Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication
    Publication number: 20030012539
    Abstract: Optical interconnect layers and methods of fabrication thereof are described. In addition, the optical interconnect layers integrated into devices such as backplane (BP), printed wiring board (PWB), and multi-chip module (MCM) level devices are described. A representative optical interconnect layer includes a first cladding layer, a second cladding layer, one or more waveguides having a waveguide core and an air-gap cladding layer engaging a portion of waveguide core, wherein the first cladding layer and the second cladding layer engage the waveguide.
    Type: Application
    Filed: April 29, 2002
    Publication date: January 16, 2003
    Inventors: Tony Mule', James D. Meindl, Paul Kohl, Stephen M. Schultz, Thomas K. Gaylord, Elias N. Glytsis, Ricardo Villalaz, Muhannad Bakir, Hollie Reed