Abstract: Laser direct structuring, LDS material is molded onto semiconductor dice arranged on die pads in a leadframe and the semiconductor dice are electrically coupled with electrically conductive leads in the leadframe via electrical connections that comprise electrically conductive formations exposed at the front surface of the LDS material, electrically conductive vias between the semiconductor dice and the front surface of the LDS material, as well as electrically conductive lines over the front surface of the LDS material that couple selected ones of the electrically conductive formations with selected ones of the second electrically conductive vias. The electrically conductive vias and lines are provided applying laser beam energy to the front surface of the laser direct structuring material at spatial positions located as a function of the electrically conductive formations exposed at the front surface of the LDS material acting as fiducials.

Abstract: An antenna-in-package semiconductor device includes a semiconductor chip coupled to a planar substrate. An encapsulation body encapsulates the semiconductor chip. The encapsulation body includes a through cavity extending to the planar substrate. A rectilinear wire antenna is mounted within the through cavity and extends, for instance from the planar substrate, along an axis that is transverse to a surface of the planar substrate to which the semiconductor chip is coupled. The rectilinear wire antenna is electrically coupled to the semiconductor chip. An insulating material fills the cavity to encapsulated the rectilinear wire antenna.

Abstract: A semiconductor chip or die is arranged on a first surface of a thermally conductive die pad of a substrate such as a leadframe. An encapsulation of insulating material in molded onto the die pad having the semiconductor die arranged on the first surface. At the second surface of the die pad, opposite the first surface, the encapsulation borders on the die pad at a borderline around the die pad. A recessed portion of the encapsulation is provided, for example, via laser ablation, at the borderline around the die pad. Thermally conductive material such as metal material is filled in the recessed portion of the encapsulation around the die pad. The surface area of the thermally conductive die pad is augmented by the filling of thermally conductive material in the recessed portion of the encapsulation thus improving thermal performance of the device.

Abstract: A software-implemented method is described to compare via a graphical interface, freely crossing data relating to simulation results with finite-element analysis software and/or data concerning injection molding machine parameters obtained following molding tests or performed jobs, wherein the data are contained in an electronic database logically structured in one or more sets, and each set is divided into at least two logical portions (82, 84), one relating to the data relating to the simulation results and one relating to the press parameters (molding tests or works carried out), and each portion comprises a plurality of data collections organized internally in a plurality of fields. Homologous fields of a first and second collection are displayed orderly through a graphical interface by finding the fields in the database through indices generated by the selections.

Abstract: A semiconductor chip is arranged over a substrate in the form of a leadframe. A set of current-carrying formations configured as conductive ribbons are coupled to the semiconductor chip. The substrate does not include electrically conductive formations for electrically coupling the conductive ribbons to each other. Electrical contacts are formed via wedge bonding, for instance, between adjacent ones of the conductive ribbons so that a contact is provided between the adjacent ones of the conductive ribbons in support of a multi-formation current-carrying channel.

Abstract: An antenna-in-package semiconductor device includes a semiconductor chip coupled to a planar substrate. An encapsulation body encapsulates the semiconductor chip. The encapsulation body includes a through cavity extending to the planar substrate. A rectilinear wire antenna is mounted within the through cavity and extends, for instance from the planar substrate, along an axis that is transverse to a surface of the planar substrate to which the semiconductor chip is coupled. The rectilinear wire antenna is electrically coupled to the semiconductor chip. An insulating material fills the cavity to encapsulated the rectilinear wire antenna.

Abstract: A software-implemented method is described to compare via a graphical interface, freely crossing data relating to simulation results with finite-element analysis software and/or data concerning injection molding machine parameters obtained following molding tests or performed jobs, wherein the data are contained in an electronic database logically structured in one or more sets, and each set is divided into at least two logical portions (82, 84), one relating to the data relating to the simulation results and one relating to the press parameters (molding tests or works carried out), and each portion comprises a plurality of data collections organized internally in a plurality of fields. Homologous fields of a first and second collection are displayed orderly through a graphical interface by finding the fields in the database through indices generated by the selections.

Abstract: A software-implemented method is described for processing results of a simulation carried out with finite element analysis software, the software being adapted to simulate a filling process of a molded piece in a mold by a molten material injected into it, wherein: results are taken from a file of simulation results, a computer Database containing technical specifications of injection molding machines is accessed and a search is performed in the Database comparing the results read from the file with technical specifications stored in the Database and associated with each press to determine whether or not one or each press of the Database is able to perform the process.

Abstract: A method is described for processing moulding parameters (Pi+1) for an injection moulding machine (10) obtained by CAE. The CAE simulation generates simulation results (Ai), first machine parameters (Pi) are generated by electronically processing the simulation results (Ai), second machine parameters (Pi+1) are obtained, different from the first ones, from the execution of another moulding process for the same object; and in an electronic database (M) accessible by a user the first and second machine parameters are saved associating them in a common collection.

Abstract: An apparatus for injection molding of fluid plastic materials includes a mold, a hot runner distributor of the fluid plastic material, at least one injector, and an actuator for controlling the opening and closing of the injector, including a jack whose cooling is performed by means of an air flow.