Abstract: The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The ventilated casing further includes a suspension for suspending the fan relative to the housing and for damping transmission of vibration originating from the fan.

Abstract: The present invention relates to a housing assembly for computer hardware and includes side wall panels that define an outer casing that has an air inlet and outlet. The housing assembly also includes a fan and operation of the fan causes streams of air to enter and exit from the inlet and outlet and air to be conveyed within the outer casing to which heat from the computer hardware can be transferred. The housing assembly also includes a noise reduction assembly that includes a tortuous passageway through which air passing through the inlet and/or outlet passes. The tortuous passageway is configured such that sound that is emitted from the fan and enters into the tortuous passageway is dissipated therein so as to minimize the level of sound emanating from the passageway.

Abstract: The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The ventilated casing further includes a damping material for damping a noise originating from a vibration generated by the fan.

Abstract: A computer system comprising a plurality of electronic components disposed within a chassis. The electronic components generate a cooling load of at least 50 CFM at 2 inches of water or greater. An air mover is disposed within said chassis and is operable to generate airflow of at least 50 CFM at 2 inches of water or greater. An air distribution system is coupled to the air mover and is operable to distribute the airflow to the plurality of electronic components.

Abstract: The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The air guiding portion has a first mode resonance frequency that is greater than the rotational frequency of the fan.

Abstract: The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The air guiding portion has a first mode resonance frequency that is greater than the rotational frequency of the fan.

Abstract: The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The ventilated casing further includes a suspension for suspending the fan relative to the housing and for damping transmission of vibration originating from the fan.

Abstract: The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The ventilated casing further includes a damping material for damping a noise originating from a vibration generated by the fan.

Abstract: The present invention relates to a housing assembly for computer hardware and includes side wall panels that define an outer casing that has an air inlet and outlet. The housing assembly also includes a fan and operation of the fan causes streams of air to enter and exit from the inlet and outlet and air to be conveyed within the outer casing to which heat from the computer hardware can be transferred. The housing assembly also includes a noise reduction assembly that includes a tortuous passageway through which air passing through the inlet and/or outlet passes. The tortuous passageway is configured such that sound that is emitted from the fan and enters into the tortuous passageway is dissipated therein so as to minimize the level of sound emanating from the passageway.

Abstract: A computer system comprising a plurality of electronic components disposed within a chassis. The electronic components generate a cooling load of at least 50 CFM at 2 inches of water or greater. An air mover is disposed within said chassis and is operable to generate airflow of at least 50 CFM at 2 inches of water or greater. An air distribution system is coupled to the air mover and is operable to distribute the airflow to the plurality of electronic components.