Patents by Inventor Rich Gauldin
Rich Gauldin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10707060Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: September 14, 2018Date of Patent: July 7, 2020Assignee: Plasma-Therm LLCInventors: Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman, Gordon M. Grivna
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Patent number: 10497621Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.Type: GrantFiled: May 6, 2016Date of Patent: December 3, 2019Assignee: Plasma-Therm LLCInventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
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Publication number: 20190013243Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: September 14, 2018Publication date: January 10, 2019Applicant: Plasma-Therm LLCInventors: Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman, Gordon M. Grivna
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Publication number: 20180254215Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.Type: ApplicationFiled: May 6, 2016Publication date: September 6, 2018Applicant: Plasma-Therm, LLCInventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
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Publication number: 20160254189Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.Type: ApplicationFiled: May 6, 2016Publication date: September 1, 2016Applicant: Plasma-Therm, LLCInventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
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Patent number: 9368404Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.Type: GrantFiled: September 23, 2013Date of Patent: June 14, 2016Assignee: Plasma-Therm LLCInventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
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Patent number: 9202737Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: June 2, 2015Date of Patent: December 1, 2015Assignee: Plasma-Therm LLCInventors: Rich Gauldin, Dwarakanath Geerpuram, Ken Mackenzie, Thierry Lazerand, David Pays-Volard, Linnell Martinez, Russell Westerman, Gordon M. Grivna, Jason Doub
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Publication number: 20150270154Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: June 2, 2015Publication date: September 24, 2015Applicant: PLASMA-THERM LLCInventors: Rich Gauldin, Dwarakanath Geerpuram, Ken Mackenzie, Thierry Lazerand, David Pays-Volard, Linnell Martinez, Russell Westerman, Gordon M. Grivna, Jason Doub
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Patent number: 9082839Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: March 7, 2014Date of Patent: July 14, 2015Assignee: Plasma-Therm LLCInventors: Rich Gauldin, Dwarakanath Geerpuram, Ken Mackenzie, Thierry Lazerand, David Pays-Volard, Linnell Martinez, Russell Westerman, Gordon M. Grivna, Jason Doub
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Patent number: 8946058Abstract: The present invention provides a method for plasma dicing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing a work piece onto the work piece support, said work piece having a support film, a frame and the substrate; loading the work piece onto the work piece support; applying a tensional force to the support film; clamping the work piece to the work piece support; generating a plasma using the plasma source; and etching the work piece using the generated plasma.Type: GrantFiled: February 14, 2013Date of Patent: February 3, 2015Assignee: Plasma-Therm LLCInventors: Rich Gauldin, Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Russell Westerman, Gordon M. Grivna
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Publication number: 20140242780Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: March 7, 2014Publication date: August 28, 2014Applicant: Plasma-Therm LLCInventors: Rich Gauldin, Dwarakanath Geerpuram, Ken Mackenzie, Thierry Lazerand, Davis Pays-Volard, Linnell Martinez, Russell Westerman, Gordon M. Grivna, Jason Doub
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Patent number: 8785332Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: February 11, 2013Date of Patent: July 22, 2014Assignee: Plasma-Therm LLCInventors: Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman, Gordon M. Grivna
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Publication number: 20140094018Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.Type: ApplicationFiled: September 23, 2013Publication date: April 3, 2014Applicant: PLASMA-THERM, LLCInventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
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Publication number: 20130230968Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: February 11, 2013Publication date: September 5, 2013Applicant: Plasma-Therm LLCInventors: Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
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Publication number: 20130230973Abstract: The present invention provides a method for plasma dicing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing a work piece onto the work piece support, said work piece having a support film, a frame and the substrate; loading the work piece onto the work piece support; applying a tensional force to the support film; clamping the work piece to the work piece support; generating a plasma using the plasma source; and etching the work piece using the generated plasma.Type: ApplicationFiled: February 14, 2013Publication date: September 5, 2013Applicant: Plasma-Therm LLCInventors: Rich Gauldin, Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Russell Westerman
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Patent number: RE46339Abstract: The present invention provides a method for plasma dicing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing a work piece onto the work piece support, said work piece having a support film, a frame and the substrate; loading the work piece onto the work piece support; applying a tensional force to the support film; clamping the work piece to the work piece support; generating a plasma using the plasma source; and etching the work piece using the generated plasma.Type: GrantFiled: September 15, 2015Date of Patent: March 14, 2017Assignee: Plasma-Therm LLCInventors: Rich Gauldin, Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Russell Westerman, Gordon Grivna