Patents by Inventor Rich Wells
Rich Wells has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8394575Abstract: Environmentally friendly thick film layers for a micro-fluid ejection head and micro-fluid ejection heads are disclosed. The environmentally friendly thick film layer includes a negative photoresist layer derived from a composition comprising a multi-functional epoxy compound, a low molecular weight polymeric difunctional epoxy compound, a monomeric difunctional epoxy compound, a methide-based photoacid generator that does not contain antimony, a chromophore and an aryl ketone solvent. Optionally the photoresist layer contains an adhesion enhancer. The negative photoresist layer is environmentally friendly and provides good resolution, well defined critical dimensions, straight side walls, and a large processing window.Type: GrantFiled: September 30, 2010Date of Patent: March 12, 2013Assignee: Lexmark International, Inc.Inventors: Xiaoming Wu, David Graham, Sean Weaver, Bart Mansdorf, Rich Wells, Joel Provence
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Patent number: 8292402Abstract: The present disclosure relates to photoresist compositions suitable for thin layer photoimageable nozzle plates for micro-fluid ejection devices and methods of making and using such thin layer nozzle plates. The photoresist compositions may comprise a high-molecular weight phenoxy resin, a di-functional epoxy resin, and a multi-functional epoxy resin.Type: GrantFiled: February 13, 2008Date of Patent: October 23, 2012Assignee: Lexmark International, Inc.Inventors: Sean Terrance Weaver, Rich Wells
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Patent number: 8173031Abstract: Nozzle members, such as for a micro-fluid ejection head, micro-fluid ejection heads, and a method for making the same. One such nozzle member includes a negative photoresist composition derived from a first di-functional epoxy compound, a relatively high molecular weight polyhydroxy ether, a photoacid generator devoid of aryl sulfonium salts, an adhesion enhancer, and an aliphatic ketone solvent. The nozzle member has a thickness ranging from about 10 microns to about 30 microns.Type: GrantFiled: December 16, 2008Date of Patent: May 8, 2012Assignee: Lexmark International, Inc.Inventors: Sean T. Weaver, Rich Wells
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Patent number: 8163819Abstract: Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).Type: GrantFiled: April 27, 2010Date of Patent: April 24, 2012Assignee: Lexmark International, Inc.Inventors: David Christopher Graham, Gary Anthony Holt, Jr., Jonathan Harold Laurer, Johnny Dale Massie, II, Melissa Marie Waldeck, Sean Terrence Weaver, Rich Wells
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Publication number: 20120082933Abstract: Environmentally friendly thick film layers for a micro-fluid ejection head and micro-fluid ejection heads are disclosed. The environmentally friendly thick film layer includes a negative photoresist layer derived from a composition comprising a multi-functional epoxy compound, a low molecular weight polymeric difunctional epoxy compound, a monomeric difunctional epoxy compound, a methide-based photoacid generator that does not contain antimony, a chromophore and an aryl ketone solvent. Optionally the photoresist layer contains an adhesion enhancer. The negative photoresist layer is environmentally friendly and provides good resolution, well defined critical dimensions, straight side walls, and a large processing window.Type: ApplicationFiled: September 30, 2010Publication date: April 5, 2012Inventors: XIAOMING WU, David Graham, Sean Weaver, Bart Mansdorf, Rich Wells, Joel Provence
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Patent number: 8007990Abstract: Thick film layers for a micro-fluid ejection head, micro-fluid ejection heads, and methods for making micro-fluid ejection head and thick film layers. One such thick film layer is derived from a difunctional epoxy component having a weight average molecular weight ranging from about 2500 to about 4000 Daltons, a photoacid generator, an aryl ketone solvent, and an adhesion enhancing component. One such thick film layer has a cross-link density upon curing that increases the dimensional stability of the thick film layer sufficient to provide flow features therein having substantially vertical walls.Type: GrantFiled: July 2, 2009Date of Patent: August 30, 2011Assignee: Lexmark International, Inc.Inventors: Girish S. Patil, Sean T. Weaver, Rich Wells
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Patent number: 7819506Abstract: Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).Type: GrantFiled: March 13, 2007Date of Patent: October 26, 2010Assignee: Lexmark International, Inc.Inventors: David Christopher Graham, Eric Spencer Hall, Gary Anthony Holt, Jr., Richard Leo Hubert, II, Johnny Dale Massie, Sean Terrance Weaver, Jonathan Harold Laurer, Rich Wells
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Publication number: 20100210759Abstract: Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).Type: ApplicationFiled: April 27, 2010Publication date: August 19, 2010Inventors: David Christopher Graham, Gary Anthony Holt, JR., Jonathan Harold Laurer, Johnny Dale Massie, II, Melissa Marie Waldeck, Sean Terrence Weaver, Rich Wells
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Patent number: 7654637Abstract: Nozzle members, such as for a micro-fluid ejection head, micro-fluid ejection heads, and a method for making the same. One such nozzle member includes a negative photoresist composition derived from a first di-functional epoxy compound, a relatively high molecular weight polyhydroxy ether, a photoacid generator devoid of aryl sulfonium salts, an adhesion enhancer, and an aliphatic ketone solvent. The nozzle member has a thickness ranging from about 10 microns to about 30 microns.Type: GrantFiled: February 24, 2006Date of Patent: February 2, 2010Assignee: Lexmark International, IncInventors: Sean T. Weaver, Rich Wells
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Publication number: 20090269707Abstract: Thick film layers for a micro-fluid ejection head, micro-fluid ejection heads, and methods for making micro-fluid ejection head and thick film layers. One such thick film layer is derived from a difunctional epoxy component having a weight average molecular weight ranging from about 2500 to about 4000 Daltons, a photoacid generator, an aryl ketone solvent, and an adhesion enhancing component. One such thick film layer has a cross-link density upon curing that increases the dimensional stability of the thick film layer sufficient to provide flow features therein having substantially vertical walls.Type: ApplicationFiled: July 2, 2009Publication date: October 29, 2009Applicant: Lexmark International, Inc.Inventors: Girish S. Patil, Sean T. Weaver, Rich Wells
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Publication number: 20090201338Abstract: The present disclosure relates to photoresist compositions suitable for thin layer photoimageable nozzle plates for micro-fluid ejection devices and methods of making and using such thin layer nozzle plates. The photoresist compositions may comprise a high-molecular weight phenoxy resin, a di-functional epoxy resin, and a multi-functional epoxy resin.Type: ApplicationFiled: February 13, 2008Publication date: August 13, 2009Inventors: Sean Terrance Weaver, Rich Wells
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Patent number: 7571979Abstract: Thick film layers for a micro-fluid ejection head, micro-fluid ejection heads, and methods for making micro-fluid ejection head and thick film layers. One such thick film layer is derived from a difunctional epoxy component having a weight average molecular weight ranging from about 2500 to about 4000 Daltons, a photoacid generator, an aryl ketone solvent, and an adhesion enhancing component. One such thick film layer has a cross-link density upon curing that increases the dimensional stability of the thick film layer sufficient to provide flow features therein having substantially vertical walls.Type: GrantFiled: February 24, 2006Date of Patent: August 11, 2009Assignee: Lexmark International, Inc.Inventors: Girish S. Patil, Sean T. Weaver, Rich Wells
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Publication number: 20090155729Abstract: Nozzle members, such as for a micro-fluid ejection head, micro-fluid ejection heads, and a method for making the same. One such nozzle member includes a negative photoresist composition derived from a first di-functional epoxy compound, a relatively high molecular weight polyhydroxy ether, a photoacid generator devoid of aryl sulfonium salts, an adhesion enhancer, and an aliphatic ketone solvent. The nozzle member has a thickness ranging from about 10 microns to about 30 microns.Type: ApplicationFiled: December 16, 2008Publication date: June 18, 2009Inventors: Sean T. Weaver, Rich Wells
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Publication number: 20090098488Abstract: Thick film layers for a micro-fluid ejection head, micro-fluid ejection heads, and methods for making micro-fluid ejection head and thick film layers. One such thick film layer is derived from a difunctional epoxy component having a weight average molecular weight ranging from about 2500 to about 4000 Daltons, a photoacid generator, an aryl ketone solvent, and an adhesion enhancing component. One such thick film layer has a cross-link density upon curing that increases the dimensional stability of the thick film layer sufficient to provide flow features therein having substantially vertical walls.Type: ApplicationFiled: December 17, 2008Publication date: April 16, 2009Inventors: Girish S Patil, Sean T. Weaver, Rich Wells
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Publication number: 20070236542Abstract: Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).Type: ApplicationFiled: May 11, 2006Publication date: October 11, 2007Inventors: David Graham, Gary Holt, Jonathan Laurer, Johnny Massie, Melissa Waldeck, Sean Weaver, Rich Wells
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Publication number: 20070229575Abstract: Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).Type: ApplicationFiled: March 13, 2007Publication date: October 4, 2007Applicant: Lexmark International, Inc.Inventors: David Christopher Graham, Eric Spencer Hall, Gary Anthony Holt, Richard Leo Hubert, Johnny Dale Massie, Sean Terrance Weaver, Jonathan Harold Laurer, Rich Wells
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Publication number: 20070076060Abstract: Nozzle members, such as for a micro-fluid ejection head, micro-fluid ejection heads, and a method for making the same. One such nozzle member includes a negative photoresist composition derived from a first di-functional epoxy compound, a relatively high molecular weight polyhydroxy ether, a photoacid generator devoid of aryl sulfonium salts, an adhesion enhancer, and an aliphatic ketone solvent. The nozzle member has a thickness ranging from about 10 microns to about 30 microns.Type: ApplicationFiled: February 24, 2006Publication date: April 5, 2007Inventors: Sean Weaver, Rich Wells
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Publication number: 20070076059Abstract: Thick film layers for a micro-fluid ejection head, micro-fluid ejection heads, and methods for making micro-fluid ejection head and thick film layers. One such thick film layer is derived from a difunctional epoxy component having a weight average molecular weight ranging from about 2500 to about 4000 Daltons, a photoacid generator, an aryl ketone solvent, and an adhesion enhancing component. One such thick film layer has a cross-link density upon curing that increases the dimensional stability of the thick film layer sufficient to provide flow features therein having substantially vertical walls.Type: ApplicationFiled: February 24, 2006Publication date: April 5, 2007Inventors: Girish Patil, Sean Weaver, Rich Wells